Patents by Inventor Lily L. Pang
Lily L. Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9303318Abstract: In one embodiment, an apparatus includes a first gas distribution assembly that includes a first gas passage for introducing a first process gas into a second gas passage that introduces the first process gas into a processing chamber and a second gas distribution assembly that includes a third gas passage for introducing a second process gas into a fourth gas passage that introduces the second process gas into the processing chamber. The first and second gas distribution assemblies are each adapted to be coupled to at least one chamber wall of the processing chamber. The first gas passage is shaped as a first ring positioned within the processing chamber above the second gas passage that is shaped as a second ring positioned within the processing chamber. The gas distribution assemblies may be designed to have complementary characteristic radial film growth rate profiles.Type: GrantFiled: October 11, 2012Date of Patent: April 5, 2016Assignee: Applied Materials, Inc.Inventors: Tuoh-Bin Ng, Yuriy Melnik, Lily L Pang, Eda Tuncel, Lu Chen, Son T Nguyen
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Publication number: 20130098455Abstract: Described herein are exemplary apparatuses having multiple gas distribution assemblies in accordance with one embodiment. In one embodiment, the apparatus includes two or more gas distribution assemblies. Each gas distribution assembly has orifices through which at least one process gas is introduced into a processing chamber. The two or more gas distribution assemblies may be designed to have complementary characteristic radial film growth rate profiles.Type: ApplicationFiled: October 11, 2012Publication date: April 25, 2013Inventors: Tuoh-Bin Ng, Yuriy Melnik, Lily L. Pang, Eda Tuncel, Lu Chen, Son T. Nguyen
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Patent number: 8317970Abstract: A gas distribution plate is formed of a metallic body having a bottom surface with plural gas disperser orifices and an internal gas manifold feeding the orifices. Each one of an array of discrete RF power applicators held in the plate includes (a) an insulating cylindrical housing extending through the plate, a portion of the housing extending outside of the plate through the bottom surface, and (b) a conductive solenoidal coil contained within the housing, a portion of the coil lying within the portion of the housing that extends outside of the plate through the bottom surface.Type: GrantFiled: June 3, 2008Date of Patent: November 27, 2012Assignee: Applied Materials, Inc.Inventors: Canfeng Lai, Lily L. Pang, Majeed A. Foad
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Publication number: 20110064545Abstract: Embodiments of the present invention provide apparatus and method for heating one or more substrates during transfer. One embodiment provides a robot blade assembly for supporting a substrate or a substrate carrier thereon. The robot blade assembly comprises a base plate, an induction heating assembly disposed on the base plate, and a top plate disposed above the induction heating assembly. Another embodiment provides an induction heating assembly disposed over a transfer chamber having a substrate transfer mechanism disposed therein.Type: ApplicationFiled: September 15, 2010Publication date: March 17, 2011Applicant: APPLIED MATERIALS, INC.Inventors: TETSUYA ISHIKAWA, Lily L. Pang, Quyen D. Pham, Donald J.K. Olgado
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Patent number: 7691755Abstract: A method is provided for performing plasma immersion ion implantation with a highly uniform seasoning film on the interior of a reactor chamber having a ceiling and a cylindrical side wall and a wafer support pedestal facing the ceiling. The method includes providing a gas distribution ring with plural gas injection orifices on a periphery of a wafer support pedestal, the orifices facing radially outwardly from the wafer support pedestal. Silicon-containing gas is introduced through the gas distribution orifices of the ring to establish a radially outward flow pattern of the silicon-containing gas. The reactor includes pairs of conduit ports in the ceiling adjacent the side wall at opposing sides thereof and respective external conduits generally spanning the diameter of the chamber and coupled to respective pairs of the ports. The method further includes injecting oxygen gas through the conduit ports into the chamber to establish an axially downward flow pattern of oxygen gas in the chamber.Type: GrantFiled: May 15, 2007Date of Patent: April 6, 2010Assignee: Applied Materials, Inc.Inventors: Shijian Li, Lily L. Pang, Majeed A. Foad, Seon-Mee Cho
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Publication number: 20090294065Abstract: A gas distribution plate is formed of a metallic body having a bottom surface with plural gas disperser orifices and an internal gas manifold feeding the orifices. Each one of an array of discrete RF power applicators held in the plate includes (a) an insulating cylindrical housing extending through the plate, a portion of the housing extending outside of the plate through the bottom surface, and (b) a conductive solenoidal coil contained within the housing, a portion of the coil lying within the portion of the housing that extends outside of the plate through the bottom surface.Type: ApplicationFiled: June 3, 2008Publication date: December 3, 2009Applicant: Applied Materials, Inc.Inventors: CANFENG LAI, LILY L. PANG, MAJEED A. FOAD
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Patent number: 7520939Abstract: A method and apparatus for cleaning the bevel of a semiconductor substrate. The apparatus generally includes a cell body having upstanding walls and a fluid drain basin, a rotatable vacuum chuck positioned centrally positioned in the fluid drain basin, and at least 3 substrate centering members positioned at equal radial increments around the rotatable vacuum chuck. The substrate centering members include a vertically oriented shaft having a longitudinal axis extending therethrough, a cap member positioned over an upper terminating end of the shaft, a raised central portion formed onto the cap member, the raised central portion having a maximum thickness at a location the coincides with the longitudinal axis, and a substrate centering post positioned on the cap member radially outward of the raised central portion, an upper terminating end of the substrate centering post extending from the cap member to a distance that exceeds the maximum thickness.Type: GrantFiled: April 16, 2004Date of Patent: April 21, 2009Assignee: Applied Materials, Inc.Inventors: Henry Ho, Lily L. Pang, Anh N. Nguyen, Alexander N. Lerner
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Publication number: 20080286982Abstract: A method is provided for performing plasma immersion ion implantation with a highly uniform seasoning film on the interior of a reactor chamber having a ceiling and a cylindrical side wall and a wafer support pedestal facing the ceiling. The method includes providing a gas distribution ring with plural gas injection orifices on a periphery of a wafer support pedestal, the orifices facing radially outwardly from the wafer support pedestal. Silicon-containing gas is introduced through the gas distribution orifices of the ring to establish a radially outward flow pattern of the silicon-containing gas. The reactor includes pairs of conduit ports in the ceiling adjacent the side wall at opposing sides thereof and respective external conduits generally spanning the diameter of the chamber and coupled to respective pairs of the ports. The method further includes injecting oxygen gas through the conduit ports into the chamber to establish an axially downward flow pattern of oxygen gas in the chamber.Type: ApplicationFiled: May 15, 2007Publication date: November 20, 2008Inventors: Shijian Li, Lily L. Pang, Majeed A. Foad, Seon-Mee Cho
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Patent number: 7285195Abstract: A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.Type: GrantFiled: June 24, 2004Date of Patent: October 23, 2007Assignee: Applied Materials, Inc.Inventors: Harald Herchen, Dmitry Lubomirsky, Bo Zheng, Lily L. Pang
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Patent number: 7223323Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.Type: GrantFiled: July 8, 2003Date of Patent: May 29, 2007Assignee: Applied Materials, Inc.Inventors: Michael X. Yang, Ming Xi, Russell C. Ellwanger, Eric B. Britcher, Bernardo Donoso, Lily L. Pang, Svetlana Sherman, Henry Ho, Anh N. Nguyen, Alexander N. Lerner, Allen L. D'Ambra, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T. Nguyen
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Patent number: 6958098Abstract: A modular lift-pin assembly includes a lift-pin having a distal end, a connector, and an actuator pin. The connector includes an actuator end having a plurality of catch fingers disposed around the actuator end. Each of the plurality of catch fingers includes a lip extending radially inwards. A lift-pin end is coupled to the distal end of the lift-pin, and the actuator pin is coupled to the actuator end of the connector.Type: GrantFiled: April 22, 2003Date of Patent: October 25, 2005Assignee: Applied Materials, Inc.Inventors: Rudolf Gujer, Thomas K. Cho, Lily L. Pang, Michael P. Karazim, Tetsuya Ishikawa
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Publication number: 20040206373Abstract: Embodiments of the invention generally provide a substrate spin rinse dry cell that may be used in a semiconductor processing system. The cell generally includes a cell body defining an interior processing volume, and a rotatable substrate support member positioned in the processing volume. The rotatable substrate support member includes a rotatable hub assembly having a plurality of upstanding substrate engaging members extending therefrom, and a central member positioned radially inward of the plurality of upstanding substrate engaging members, the central member having a plurality of backside fluid dispensing nozzles and at least one backside gas dispensing nozzle positioned thereon.Type: ApplicationFiled: October 6, 2003Publication date: October 21, 2004Applicant: Applied Materials, Inc.Inventors: Bernardo Donoso, Tetsuya Ishikawa, Lily L. Pang, Svetlana Sherman
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Publication number: 20040206375Abstract: A method and apparatus for cleaning the bevel of a semiconductor substrate. The apparatus generally includes a cell body having upstanding walls and a fluid drain basin, a rotatable vacuum chuck positioned centrally positioned in the fluid drain basin, and at least 3 substrate centering members positioned at equal radial increments around the rotatable vacuum chuck. The substrate centering members include a vertically oriented shaft having a longitudinal axis extending therethrough, a cap member positioned over an upper terminating end of the shaft, a raised central portion formed onto the cap member, the raised central portion having a maximum thickness at a location the coincides with the longitudinal axis, and a substrate centering post positioned on the cap member radially outward of the raised central portion, an upper terminating end of the substrate centering post extending from the cap member to a distance that exceeds the maximum thickness.Type: ApplicationFiled: April 16, 2004Publication date: October 21, 2004Applicant: Applied Materials, Inc.Inventors: Henry Ho, Lily L. Pang, Anh N. Nguyen, Alexander N. Lerner
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Publication number: 20040016637Abstract: Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.Type: ApplicationFiled: July 8, 2003Publication date: January 29, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Michael X. Yang, Ming Xi, Russell C. Ellwanger, Eric B. Britcher, Bernardo Donoso, Lily L. Pang, Svetlana Sherman, Henry Ho, Anh N. Nguyen, Alexander N. Lerner, Allen L. D'Ambra, Arulkumar Shanmugasundram, Tetsuya Ishikawa, Yevgeniy Rabinovich, Dmitry Lubomirsky, Yeuk-Fai Edwin Mok, Son T. Nguyen
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Publication number: 20030205329Abstract: A modular lift-pin assembly includes a lift-pin having a distal end, a connector, and an actuator pin. The connector includes an actuator end having a plurality of catch fingers disposed around the actuator end. Each of the plurality of catch fingers includes a lip extending radially inwards. A lift-pin end is coupled to the distal end of the lift-pin, and the actuator pin is coupled to the actuator end of the connector.Type: ApplicationFiled: April 22, 2003Publication date: November 6, 2003Inventors: Rudolf Gujer, Thomas K. Cho, Lily L. Pang, Michael P. Karazim, Tetsuya Ishikawa
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Patent number: 6572708Abstract: A modular lift-pin assembly comprises a lift-pin having a distal end and a connector having a lift-pin end and an actuator end. The lift-pin end of the connector is coupled to the distal end of the lift-pin and an actuator pin is then coupled to the actuator end of the connector to actuate the lift-pin through the connector.Type: GrantFiled: February 28, 2001Date of Patent: June 3, 2003Assignee: Applied Materials Inc.Inventors: Rudolf Gujer, Thomas K. Cho, Lily L. Pang, Michael P. Karazim, Tetsuya Ishikawa
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Patent number: 6517634Abstract: A semiconductor substrate processing chamber is disclosed generally comprising a chamber body that has a semiconductor substrate support assembly disposed in the chamber body. A lid assembly is movably coupled to the chamber body via a dual pivot hinge assembly. The hinge assembly provides two pivot points that minimize the abrasion and pinching of an o-ring disposed between the lid assembly and the chamber body upon closing of the lid assembly.Type: GrantFiled: February 28, 2001Date of Patent: February 11, 2003Assignee: Applied Materials, Inc.Inventors: Lily L. Pang, Thomas K. Cho, Tetsuya Ishikawa
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Patent number: 6450117Abstract: A substrate processing chamber 30 comprising a first gas distributor 65 adapted to provide a process gas into the chamber 30 to process the substrate 25, a second gas distributor 215 adapted to provide a cleaning gas into the chamber 30 to clean the chamber, and an exhaust 90 to exhaust the process gas or cleaning gas from the chamber 30.Type: GrantFiled: August 7, 2000Date of Patent: September 17, 2002Assignee: Applied Materials, Inc.Inventors: Laxman Murugesh, Padmanaban Krishnaraj, Michael Cox, Canfeng Lai, Narendra Dubey, Tom K. Cho, Sudhir Ram Gondhalekar, Lily L. Pang
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Publication number: 20020117262Abstract: A semiconductor substrate processing chamber is disclosed generally comprising a chamber body that has a semiconductor substrate support assembly disposed in the chamber body. A lid assembly is movably coupled to the chamber body via a dual pivot hinge assembly. The hinge assembly provides two pivot points that minimize the abrasion and pinching of an o-ring disposed between the lid assembly and the chamber body upon closing of the lid assembly.Type: ApplicationFiled: February 28, 2001Publication date: August 29, 2002Applicant: Applied Materials, Inc.Inventors: Lily L. Pang, Thomas K. Cho, Tetsuya Ishikawa
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Patent number: 6363624Abstract: An apparatus for distributing a cleaning gas to a semiconductor substrate processing chamber. The apparatus comprises a feed block disposed on top of the processing chamber and a support block disposed over the feed block. The feed block and the support block slidably interfit and are axially moveable with respect to one another.Type: GrantFiled: November 21, 2000Date of Patent: April 2, 2002Assignee: Applied Materials, Inc.Inventors: Lily L. Pang, Thomas K. Cho, Tetsuya Ishikawa