Patents by Inventor Lim Cheang Hai

Lim Cheang Hai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
    Patent number: 6022759
    Abstract: A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
    Type: Grant
    Filed: February 18, 1998
    Date of Patent: February 8, 2000
    Assignees: Fujitsu Limited, Fujitsu Automation Limited
    Inventors: Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake, Susumu Abe, Junichi Kasai, Masao Sakuma, Yoshimi Suzuki, Yasuhiro Shinma
  • Semiconductor device, base member for semiconductor device and semiconductor device unit
    Patent number: 5747874
    Abstract: A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.
    Type: Grant
    Filed: September 18, 1995
    Date of Patent: May 5, 1998
    Assignees: Fujitsu Limited, Fujitsu Automation Limited
    Inventors: Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake, Susumu Abe, Junichi Kasai, Masao Sakuma, Yoshimi Suzuki, Yasuhiro Shinma