Abstract: An integrated circuit (“IC”) package including an IC assembly mounted on a leadframe and an encapsulant block covering the IC assembly and portions of the leadframe. The encapsulant block has a molded chamfered outer surface portion and the leadframe has a saw cut outer periphery.

Abstract: A transfer mold assembly including a first mold chase; a second mold chase; a first lead frame; at least one first lead frame die mounted on the first lead frame; a second lead frame substantially identical to the first lead frame; at least one second lead frame die mounted on the second lead frame; and wherein the first and second mold chases define a transfer mold cavity and wherein the first and second lead frames are positioned in stacked relationship inside the transfer mold cavity. Also disclosed is a method of integrated circuit packaging.