Patents by Inventor Lim LAY YEAP

Lim LAY YEAP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160056095
    Abstract: A leadframe strip includes a plurality of leads chemically etched into a metal sheet, a plurality of support structures chemically etched into the metal sheet, and a plurality of connecting structures chemically etched into the metal sheet. Each of the connecting structures is integrally connected at a first end to one of the leads and integrally connected at a second end to one of the support structures so that the leads are held in place by the support structures. The width of each connecting structure is at a minimum between the first and second ends of that connecting structure, increases from the minimum in a direction toward the first end, and increases from the minimum in a direction toward the second end. A method of manufacturing such a leadframe strip is also provided.
    Type: Application
    Filed: August 25, 2014
    Publication date: February 25, 2016
    Inventors: Lim Lay Yeap, Tai Chiew Li, Yong Wae Chet, Tay Wee Boon, See Thiong Zhou
  • Publication number: 20150325503
    Abstract: A method of singularizing a matrix array of packages is provided, wherein the method comprises providing a matrix array of packages, wherein the matrix array is formed on a leadframe; cutting predefined leads of the leadframe by a punching process; and singularizing the packages of the matrix array of packages by a sawing process.
    Type: Application
    Filed: May 8, 2014
    Publication date: November 12, 2015
    Applicant: Infineon Technologies AG
    Inventors: Lim LAY YEAP, Khoo Nee Wan, See Thiong Zhou