Abstract: LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

Abstract: LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

Abstract: A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

Abstract: Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.

Abstract: A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

Abstract: A Light Emitting Diode (LED) device with a vertical leadframe includes a lamp structure and a leadframe vertically aligned within the lamp structure. The leadframe includes a portion outside of the lamp structure that is configured for surface mounting. Since the leadframe is vertically aligned, a reflector cup connected to the leadframe can be relatively deep.

Abstract: A wire bonding technique for manufacturing semiconductor devices that results in a bonded wire having a small loop height. The wire bonding technique involves a capillary tool that ball bonds a wire to a first contact point, then moves upwards, and then towards a second contact point to which the wire will be attached. The capillary tool only moves towards the second contact point in the lateral direction. The height of the wire loop of the bonded wires can be controlled to have desired wire loop heights. The bonding technique can be used in semiconductor devices with stacked dice and in devices where a die and a contact lead are approximately at the same height.

Abstract: This invention is directed to methods, procedures and apparatus for controlling the portioning of flowable materials, particularly soft serve frozen confections, though also including other flowable products. Such other products may include soups, beverages such as milk shakes, soft drinks, and alcoholic beverages such as beers, and so forth. Typically a method for controlling the delivery of a portion of a flowable substance includes the steps of: i) Delivering the flowable substance in a stream; and ii) Noting the time for the delivery of a portion of a targeted amount; and iii) Determining the weight of the portion, and iv) Using this information to influence the delivery of further substance to meet a pre-determined target value. A preferred method is characterized by both the weight of the flowable substance being delivered and the time for the delivery of same being repeatedly or continuously assessed to achieve delivery of a pre-determined target weight or volume.