Abstract: A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

Abstract: Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.

Abstract: A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and a non-active surface and one or more contacts positioned adjacent the semiconductor chip. Electrical connections are formed between the contacts and the semiconductor chip. An adhesive tape provided adjacent the non-active surface of the semiconductor chip and the one or more contacts positioned adjacent the semiconductor chip. An adhesive material provided between the non-active surface of the chip and the adhesive tape.

Abstract: A wire bonding technique for manufacturing semiconductor devices that results in a bonded wire having a small loop height. The wire bonding technique involves a capillary tool that ball bonds a wire to a first contact point, then moves upwards, and then towards a second contact point to which the wire will be attached. The capillary tool only moves towards the second contact point in the lateral direction. The height of the wire loop of the bonded wires can be controlled to have desired wire loop heights. The bonding technique can be used in semiconductor devices with stacked dice and in devices where a die and a contact lead are approximately at the same height.