Patents by Inventor Lim Shoa Siong

Lim Shoa Siong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same
    Publication number: 20110049708
    Abstract: A semiconductor chip interconnection structure and a semiconductor package formed using the same are provided. The semiconductor chip interconnection structure comprises a chip, a bump assembly and an electrical element. The chip comprises a pad and has a pad aperture from which the pad is exposed. The bump assembly comprises a first bump and a second bump. The first bump is disposed on the pad. The second bump is disposed on the first bump. The outer diameter of the second bump is not less than the outer diameter of the first bump. The electrical element is connected to the bump assembly.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 3, 2011
    Inventors: Lim Shoa Siong, Lim Kian Hock, Chew Hwee-Seng Jimmy