Patents by Inventor Lim Siong San

Lim Siong San has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and process for embedding electrically conductive elements in a dielectric layer
    Patent number: 7631423
    Abstract: A method is provided for fabricating a multilayer printed circuit board, including embedded electrically conductive elements formed as part of the fabrication of the layers of the printed circuit board. An insulating layer and a conductive layer are then pressed over the electrically conductive elements such that the electrically conductive elements protrude from the surface of the conductive layer. A mechanical process is the applied to remove these protrusions to expose the embedded electrically conductive elements. An electrically conductive undercoat may be applied over the surface of the conductive layer and a second circuit pattern is formed over the electrically conductive undercoat.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: December 15, 2009
    Assignee: Sanmina-Sci Corporation
    Inventors: Lim Siong San, Neo Mok Choon, Kevin Lim, Kelvin Yeow, Tan Kwang Chiah