Abstract: An exemplary write method disclosed herein includes receiving a request to write data to a consecutive sequence of logical block addresses (LBAs) that is the mapped to a non-contiguous sequence of data tracks on a storage medium, and writing the data of the consecutive sequence of LBAs to a non-contiguous sequence of data tracks on the storage medium and according to a consecutive track order.

Abstract: A divider sheet may consist of a label insert and a divider sheet with a pair of side edges. A tab is attached to at least one of side edges. The tab includes a tab section projecting out from at least one of the side edges in which the tab is attached to and a pocket section that is at least partially adhered to the tab section. The tab section and the pocket section form a pocket with an opening horizontally at the top of the tab and extending partially along at least one of the edges adjoining to the opening such that it forms a flap that is able to be flipped open from the divider sheet at the top of the pocket's opening which eases the insertion and removal of a label insert into the pocket.

Abstract: In one embodiment of the invention, a lead-frame is designed for use in IC packages such as those conforming to the TO 220 standard or other standards for power packages. The device areas of the lead-frame are arranged in columns, and each column is molded so as to expose a portion of the leads. The device areas can then be singulated by sawing, as in conventional QFN packages. In this manner, packages conforming to power package standards such as the TO 220 standard can be produced much quicker and cheaper than they can in conventional trim and forming methods.

Abstract: According to some embodiments, a queue structure includes a validity vector and an order array.

Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.