Patents by Inventor Lim Thiam Chyc

Lim Thiam Chyc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die package
    Patent number: 7489028
    Abstract: Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: February 10, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Edmund Lua Koon Tian, Lim Thiam Chyc
  • Die package
    Patent number: 6919645
    Abstract: Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: July 19, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Edmund Lua Koon Tian, Lim Thiam Chyc
  • Die package
    Publication number: 20040164410
    Abstract: Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 26, 2004
    Applicant: Micron Technology, Inc.
    Inventors: Edmund Lua Koon Tian, Lim Thiam Chyc