Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.

Abstract: The present invention relates to backsheets containing formulated thermoplastic polyolefin (TPO) which may be used with photovoltaic modules. More specifically, the backsheets of the present invention have a first exterior layer that comprises TPO and a polyamide, such that a residual fusion heat after lamination of that layer is at least 40 J/g. Using such a layer, sufficient bonding to the encapsulant of a photovoltaic module can be achieved, while maintaining high heat resistance, having low distortion at high operating temperatures, and having relatively low high water vapor transmission rate. The present invention also relates to photovoltaic modules containing the backsheets of the present invention, as well as to methods for making the backsheets of the present invention.