Patents by Inventor Limor Ben-Asher
Limor Ben-Asher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10421881Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from to mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: GrantFiled: October 22, 2018Date of Patent: September 24, 2019Assignee: CYMER-DAYTON, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10301506Abstract: A process for preparing polymer. An embodiment of a method includes generating a resin solution including a first reaction solvent and a polymer resin dissolved therein; deploying the resin solution into a precipitation solvent contained in a chamber of a reaction vessel, wherein deploying the resin solution includes generating droplets of the resin solution; disturbing a resulting mixture of the resin solution and the precipitation solvent, wherein the mixture produces a precipitate; and generating a polymer powder from the mixture, including isolating the precipitate from a remaining portion of the mixture, and drying the isolated precipitate.Type: GrantFiled: August 26, 2016Date of Patent: May 28, 2019Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10280335Abstract: Embodiments generally relate to preparation of polyamide-imide resins using N-Formyl Morpholine:3-Methoxy N,N-Dimethylpropanamide. An embodiment of a method includes generating a polymer solution using a polymerization process, the polymerization process including preparing a solvent including at least N-formylmorpholine (NFM) or a combination of NFM with 3-methoxy N,N-dimethylpropanamide (MDP) as a cosolvent, mixing methylene diphenyl diisocyanate (MDI) and trimellitic anhydride (TMA) with the solvent to generate the polymer solution, and diluting the polymer solution by adding an NFM:MDP solvent mixture or MDP into the generated polymer solution. The method further includes processing the diluted polymer solution to generate polyamideimide polymer or a polyamide-amic acid resin polymer.Type: GrantFiled: August 26, 2016Date of Patent: May 7, 2019Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Publication number: 20190112501Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from to mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: ApplicationFiled: October 22, 2018Publication date: April 18, 2019Applicant: CYMER-DAYTON, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 10106702Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from a mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: GrantFiled: August 26, 2016Date of Patent: October 23, 2018Assignee: Cymer-Dayton, LLCInventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Publication number: 20170349713Abstract: A process for preparing polymer. An embodiment of a method includes generating a resin solution including a first reaction solvent and a polymer resin dissolved therein; deploying the resin solution into a precipitation solvent contained in a chamber of a reaction vessel, wherein deploying the resin solution includes generating droplets of the resin solution; disturbing a resulting mixture of the resin solution and the precipitation solvent, wherein the mixture produces a precipitate; and generating a polymer powder from the mixture, including isolating the precipitate from a remaining portion of the mixture, and drying the isolated precipitate.Type: ApplicationFiled: August 26, 2016Publication date: December 7, 2017Inventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Publication number: 20170349782Abstract: A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from a mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.Type: ApplicationFiled: August 26, 2016Publication date: December 7, 2017Inventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Publication number: 20170349706Abstract: Embodiments generally relate to preparation of polyamide-imide resins using N-Formyl Morpholine:3-Methoxy N,N-Dimethylpropanamide. An embodiment of a method includes generating a polymer solution using a polymerization process, the polymerization process including preparing a solvent including at least N-formylmorpholine (NFM) or a combination of NFM with 3-methoxy N,N-dimethylpropanamide (MDP) as a cosolvent, mixing methylene diphenyl diisocyanate (MDI) and trimellitic anhydride (TMA) with the solvent to generate the polymer solution, and diluting the polymer solution by adding an NFM:MDP solvent mixture or MDP into the generated polymer solution. The method further includes processing the diluted polymer solution to generate polyamideimide polymer or a polyamide-amic acid resin polymer.Type: ApplicationFiled: August 26, 2016Publication date: December 7, 2017Inventors: Limor Ben-Asher, David Edward Noga, Zhongliang Zhu, Anderson Bouton
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Patent number: 9815941Abstract: Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.Type: GrantFiled: April 15, 2015Date of Patent: November 14, 2017Assignee: CYMER-DAYTON, LLCInventors: Carissa M. Kelly, David E. Noga, John E. Sidenstick, Limor Ben-Asher, Atuso Kondo
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Patent number: 9725617Abstract: A polyamideimide and polyamide amic acid resin polymer that allows for reduced levels of toxicity in manufacturing. In an embodiment, a coating composition comprises at least one polyamideimide resin, at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from a group consisting of methyl acetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.Type: GrantFiled: April 15, 2015Date of Patent: August 8, 2017Assignee: FUJIFILM Hunt Chemicals U.S.A., Inc.Inventors: Carissa M. Kelly, David E. Noga, John E. Sidenstick, Limor Ben-Asher, Atsuo Kondo
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Publication number: 20150299393Abstract: Techniques and mechanisms to reduce toxicity in manufacturing of a polyamideimide and polyamide amic acid resin polymer. In an embodiment, a polyamideimide is produced using at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from the group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.Type: ApplicationFiled: April 15, 2015Publication date: October 22, 2015Inventors: Carissa M. Kelly, David E. Noga, John E. Sidenstick, Limor Ben-Asher, Atsuo Kondo
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Publication number: 20150299513Abstract: A polyamideimide and polyamide amic acid resin polymer that allows for reduced levels of toxicity in manufacturing. In an embodiment, a coating composition comprises at least one polyamideimide resin, at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from a group consisting of methyl actetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ?-caprolactone and methylcyclohexane.Type: ApplicationFiled: April 15, 2015Publication date: October 22, 2015Inventors: Carissa M. Kelly, David E. Noga, John E. Sidenstick, Limor Ben-Asher, Atsuo Kondo