Patents by Inventor Lin-An Chen

Lin-An Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240172085
    Abstract: Methods, systems, apparatus for wireless communication are described. A method of wireless communication is provided to include performing, by a first node of an integrated access and backhaul (IAB) network, a data transmission with a second node in the IAB. In addition, apparatus for implementing the method is also described.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Xueying DIAO, Lin CHEN, Ying HUANG
  • Publication number: 20240166789
    Abstract: The present invention provides a conjugated diene based rubber comprising a conjugated diene based copolymer comprising at least two conjugated diene monomer units and optionally comprising a vinyl aromatic hydrocarbon monomer unit, wherein the conjugated diene based copolymer comprises a first block composed of a first conjugated diene monomer unit and the vinyl aromatic hydrocarbon monomer unit or a second conjugated diene monomer unit, the second conjugated diene monomer unit being distinct from the first conjugated diene monomer unit, the first block being random; and a second block, comprising at least the second conjugated diene monomer unit and optionally comprising the vinyl aromatic hydrocarbon monomer unit, wherein the first block is connected to the second block, and the amount of the vinyl aromatic hydrocarbon monomer units or the second conjugated diene monomer units is at least 35 wt % of the first block.
    Type: Application
    Filed: November 17, 2023
    Publication date: May 23, 2024
    Applicant: TSRC Corporation
    Inventors: Chun-Lin Chen, Yun-Ta Lee
  • Publication number: 20240170341
    Abstract: Semiconductor devices and methods of manufacture are discussed. In an embodiment, a method of manufacturing a semiconductor device includes: forming first nanostructures from a first material over a substrate; forming second nanostructures from a second material different from the first material over the substrate, wherein the first nanostructures and the second nanostructures alternate vertically above the substrate; removing the first nanostructures; after the removing the first nanostructures forming an interposer in between the second nanostructures; after the forming the interposer forming a first source/drain region over the substrate and in direct physical contact with the second nanostructures; and removing the interposer exposing surfaces of each of the second nanostructures.
    Type: Application
    Filed: January 10, 2023
    Publication date: May 23, 2024
    Inventors: Yu-Ming Chen, Tsung-Lin Lee, Chia-Ho Chu, Sung-En Lin, Sen-Hong Syue
  • Publication number: 20240164795
    Abstract: A surgical instrument includes a rod and a push portion. The push portion includes a first end connected to an end of the rod and a second end having a blade portion. The push portion includes a plurality of grooves. The plurality of grooves is recessed in a surface of the push portion and is spaced from each other. Each two adjacent grooves has a rib formed therebetween. A top face of a cross section of each rib is the surface of the push portion. Each rib has a guiding face on the cross section of the push portion. The guiding face is connected to the surface of the push portion. The guiding face faces a rotating direction of the rod. An angle between the guiding face and the surface of the push portion in the cross section is greater than 90°.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Inventors: Tung-Lin TSAI, Chun-Chieh TSENG, Chun-Ming CHEN, Yue-Jun WANG, Pei-Hua WANG
  • Publication number: 20240167898
    Abstract: A flexible strain sensor comprises a sensing area, a connection area, an encapsulation layer and a flexible substrate. The sensing area and the connection area are made of the same conductive material by adjusting size structures of different areas. The sensor is prepared by performing one-step printing of carbon black-silicone rubber composite conductive paste on a fabric substrate on the basis of a screen printing process. The method is simple and convenient to operate, is low in manufacturing cost and is suitable for large-scale production; and the prepared sensor has a high sensitivity (?10), a large strain range(˜100%), a low hysteresis quality and a good stability, and can be applied to the fields of human body motion detection, intelligent medical service, etc. The method for preparing a sensor in the present invention has important reference value for industrial production of a flexible strain sensor.
    Type: Application
    Filed: October 18, 2021
    Publication date: May 23, 2024
    Inventors: Lin Shu, Xiaobin Chen, Xiangmin Xu
  • Patent number: 11990471
    Abstract: Gate cutting techniques disclosed herein form gate isolation fins to isolate metal gates of multigate devices from one another before forming the multigate devices, and in particular, before forming the metal gates of the multigate devices. An exemplary device includes a first multigate device having first source/drain features and a first metal gate that surrounds a first channel layer and a second multigate device having second source/drain features and a second metal gate that surrounds a second channel layer. A gate isolation fin, which separates the first metal gate and the second metal gate, includes a first dielectric layer having a first dielectric constant and a second dielectric layer having a second dielectric constant disposed over the first dielectric layer. The second dielectric constant is less than the first dielectric constant. A gate isolation end cap may be disposed on the gate isolation fin to provide additional isolation.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuo-Cheng Chiang, Shi Ning Ju, Guan-Lin Chen, Kuan-Ting Pan, Chih-Hao Wang
  • Patent number: 11989426
    Abstract: Systems, apparatus and methods are provided for power management of non-volatile storage (NVM) systems. A non-volatile storage system may include a first interface to be coupled to a host, a NVM device, a storage controller including a command queue and a processor, and a second interface coupling the storage controller and the NVM device. The processor may be configured to handle data transfer requests from the host in an active power state, monitor the command queue and a data transfer rate on the first interface, determine that the data transfer rate falls below a predetermined threshold and the command queue is empty, enter a pseudo-idle power state, determine that there is a new command from the host, and exit the pseudo-idle power state and enter the active power state.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: May 21, 2024
    Assignee: Innogrit Technologies Co., Ltd.
    Inventors: Gang Zhao, Ming Lu, Lin Chen
  • Patent number: 11990339
    Abstract: A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent damage to other underlying layers exposed by the patterning of the middle layer and intervening layers, an inhibitor is included within an etching process in order to inhibit the amount of material removed from the underlying layers.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Jou Lian, Yao-Wen Hsu, Neng-Jye Yang, Li-Min Chen, Chia-Wei Wu, Kuan-Lin Chen, Kuo Bin Huang
  • Patent number: 11988999
    Abstract: A transaction harmony degree-based method and system for transaction matching between a power grid and building energy. The method includes: obtaining a transaction harmony degree of a historical transaction cycle; sending, by using a blockchain, the transaction harmony degree to a corresponding building energy user, and sending a maximum compensated electricity price and an expected compensated electricity price in peak-valley regulation to all building energy users; determining, by each building energy user, a transaction-based compensated electricity price in the peak-valley regulation based on the received transaction harmony degree and the received maximum compensated electricity price and expected compensated electricity price in the peak-valley regulation, and feeding back the transaction-based compensated electricity price in the peak-valley regulation to a power grid; and determining, by the power grid, a building energy user that successfully performs transaction matching with the power grid.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: May 21, 2024
    Assignees: State Grid Beijing Electric Power Company, China Agricultural University, State Grid Corporation of China
    Inventors: Shuang Zeng, Xianglong Li, Yifeng Ding, Anqi Liang, Mingquan Qiu, Zhao Wang, Ping Chen, Qijing Xing, Lin Ma, Dapeng Duan, Huanna Niu, Xuwu Ge, Zongsheng Li
  • Patent number: 11990987
    Abstract: A multi-wavelength light source includes a laser, an optical modulator, an optical mixer, an optical demultiplexer, and an optical power adjuster that are sequentially coupled. The laser is configured to generate a first optical signal. The optical modulator modulates the first optical signal, to generate a second optical signal, where the second optical signal includes at least two wavelength components. The optical mixer mixes frequencies based on the at least two wavelength components to generate a third optical signal, where the third optical signal includes at least four wavelength components. The demultiplexer separates the at least four wavelength components. The optical power adjuster adjusts, based on a specified power threshold, a power of each of the wavelength components obtained by separation by the demultiplexer.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: May 21, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hongmin Chen, Shuangyuan Wu, Lin Wu, Lantian Liao, Xiaogeng Xu
  • Patent number: 11989046
    Abstract: Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Haruki Mori, Hidehiro Fujiwara, Zhi-Hao Chang, Yangsyu Lin, Yu-Hao Hsu, Yen-Huei Chen, Hung-Jen Liao, Chiting Cheng
  • Patent number: 11990968
    Abstract: A RF module and an electronic device. The RF module includes a RF transceiver module; a first antenna configured to transmit a first transmission signal, and receive a first main reception signal and a second diversity reception signal; a first triplexer connected to the RF transceiver module and the first antenna, and being configured to isolate the first transmission signal, the first main reception signal, and the second diversity reception signal; a second antenna configured to transmit a second transmission signal, receive a second main reception signal and a first diversity reception signal, and a frequency band of the first transmission signal being different from that of the second transmission signal; and a second triplexer connected to the RF transceiver module and the second antenna, and being configured to isolate the second transmission signal, the second main reception signal, and the first diversity reception signal.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: May 21, 2024
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Feng Chen, Lin Tong
  • Patent number: 11989001
    Abstract: One or more video gateway devices configured to: access pre-configured criteria including at least a first condition, a second condition, and a first event; access video content captured by cameras configured to capture video of areas of a manufacturing facility; determine, based on an analysis of the video content, that the first condition is satisfied; access sensor data from one or more sensors; determine, based on an analysis of the sensor data, that the second condition is satisfied; and based on determining that the first and second conditions are satisfied, cause the first event to be executed.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 21, 2024
    Assignee: Samsara Inc.
    Inventors: Saleh ElHattab, Kathryn Siegel, Noah Paul Gonzales, Etienne Jean-Claude Dejoie, Maxwell Coleman Goldberg, Joyce Tian Chen, Kelsey Michelle Lam, Adam Eric Funkenbusch, Karthikram Rajadurai, Rhea Lin, Sebastian Richard Sangervasi, Aidan Siobhan Madigan-Curtis, William Arthur Hughes
  • Patent number: 11990400
    Abstract: Some embodiments relate to a method for forming an integrated chip, the method includes forming a first conductive wire and a second conductive wire over a substrate. A dielectric structure is formed laterally between the first conductive wire and the second conductive wire. The dielectric structure comprises a first dielectric liner, a dielectric layer disposed between opposing sidewalls of the first dielectric liner, and a void between an upper surface of the first dielectric liner and a lower surface of the dielectric layer. A dielectric capping layer is formed along an upper surface of the dielectric structure. Sidewalls of the dielectric capping layer are aligned with sidewalls of the dielectric structure.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee
  • Patent number: 11988711
    Abstract: A test circuit includes a scan chain and a wrapper chain. The wrapper chain shifts in a test pattern according a first clock. The scan chain is coupled to the wrapper chain via a logic combination of a circuit under test. The wrapper chain is configured to transmit the test pattern to the scan chain via the logic combination according to a second clock in a capture phase. The wrapper chain includes a first, a second wrapper cell, and an asynchronous register. The first wrapper cell sequentially shifts in two bits of the test pattern in the shift-in phase. The second wrapper cell shifts in the first bit of the test pattern in the shift-in phase. The asynchronous register conducts the first wrapper cell to the second wrapper cell in the shift-in phase, and latches the second wrapper cell in the capture phase.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: May 21, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Po-Lin Chen, Chun-Teng Chen
  • Patent number: 11990488
    Abstract: A grid structure in a pixel array may be at least partially angled or tapered toward a top surface of the grid structure such that the width of the grid structure approaches a near-zero width near the top surface of the grid structure. This permits the spacing between color filter regions in between the grid structure to approach a near-zero spacing near the top surfaces of the color filter regions. The tight spacing of color filter regions provided by the angled or tapered grid structure provides a greater surface area and volume for incident light collection in the color filter regions. Moreover, the width of the grid structure may increase at least partially toward a bottom surface of the grid structure such that the wider dimension of the grid structure near the bottom surface of the grid structure provides optical crosstalk protection for the pixel sensors in the pixel array.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: May 21, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Lin Chen, Ching-Chung Su, Chun-Hao Chou, Kuo-Cheng Lee
  • Patent number: 11990547
    Abstract: A method for fabricating a semiconductor device includes the steps of forming a gate structure on a substrate, forming recesses adjacent to two sides of the gate structure, forming a buffer layer in the recesses, forming a first linear bulk layer on the buffer layer, forming a second linear bulk layer on the first linear bulk layer, forming a bulk layer on the second linear bulk layer, and forming a cap layer on the bulk layer.
    Type: Grant
    Filed: September 27, 2020
    Date of Patent: May 21, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yu Chen, Bo-Lin Huang, Jhong-Yi Huang, Keng-Jen Lin, Yu-Shu Lin
  • Publication number: 20240158550
    Abstract: The disclosure provides a vinyl-containing aromatic alicyclic copolymer, a resin composition and a product thereof. The resin composition includes the vinyl-containing aromatic alicyclic copolymer, and the product made of the resin composition has a Tg of greater than 200° C., a dielectric constant Dk (10 GHz) of less than 3.0 and a dielectric loss Df (10 GHz) of less than 0.0014.
    Type: Application
    Filed: December 6, 2022
    Publication date: May 16, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chi-Lin Chen
  • Publication number: 20240160058
    Abstract: A splicing display panel and a splicing display device are provided. The splicing display panel includes at least two spliced first display modules and at least one second display module. There is a seam between two adjacent first display modules. A portion of the first display module corresponding to a bezel area is provided with an accommodating slot. The accommodating slot of one of the first display modules is spliced with the accommodating slot of another one of the first display modules to form an accommodating cavity. The at least one second display module is arranged in the accommodating cavity, and the second display module covers the seam.
    Type: Application
    Filed: May 18, 2022
    Publication date: May 16, 2024
    Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
    Inventors: Lin LI, Bo SUN, Feng ZHENG, Yichen BAI, Meng CHEN
  • Publication number: 20240162227
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The method includes forming a first dielectric feature between first and the second fin structures, wherein each first and second fin structure includes first semiconductor layers and second semiconductor layers alternatingly stacked and in contact with the first dielectric layer. The method also includes removing the second semiconductor layers so that the first semiconductor layers of the first and second fin structures extend laterally from a first side and a second side of the first dielectric feature, respectively, trimming the first dielectric feature so that the first dielectric feature has a reduced thickness on both first and the second sides, and forming a gate electrode layer to surround each of the first semiconductor layers of the first and second fin structures.
    Type: Application
    Filed: November 19, 2023
    Publication date: May 16, 2024
    Inventors: Guan-Lin CHEN, Kuo-Cheng CHIANG, Shi Ning JU, Jung-Chien CHENG, Chih-Hao WANG, Kuan-Lun CHENG