Abstract: A semiconductor package assembly includes a substrate, a die stack including at least a bottom die, an inert top spacer, and at least a first inert base spacer. The inert top and base spacers are exclusive of any circuits. A top surface of the inert top spacer is directly attached to a bottom surface of the bottom die in the die stack. A top surface of the first inert base spacer is directly attached to a bottom surface of the inert top spacer and a bottom surface of the first inert base spacer is directly attached to the substrate. The footprint of the inert base spacer is smaller than the footprint of the inert top spacer. In some embodiments, the footprint of the inert base spacer is positioned entirely within the footprint of the inert top spacer.

Abstract: A semiconductor package assembly includes a substrate, a die stack including at least a bottom die, an inert top spacer, and at least a first inert base spacer. The inert top and base spacers are exclusive of any circuits. A top surface of the inert top spacer is directly attached to a bottom surface of the bottom die in the die stack. A top surface of the first inert base spacer is directly attached to a bottom surface of the inert top spacer and a bottom surface of the first inert base spacer is directly attached to the substrate. The footprint of the inert base spacer is smaller than the footprint of the inert top spacer. In some embodiments, the footprint of the inert base spacer is positioned entirely within the footprint of the inert top spacer.

Abstract: A semiconductor package assembly includes a substrate, a die stack including at least a bottom die, an inert top spacer, and at least a first inert base spacer. The inert top and base spacers are exclusive of any circuits. A top surface of the inert top spacer is directly attached to a bottom surface of the bottom die in the die stack. A top surface of the first inert base spacer is directly attached to a bottom surface of the inert top spacer and a bottom surface of the first inert base spacer is directly attached to the substrate. The footprint of the inert base spacer is smaller than the footprint of the inert top spacer. In some embodiments, the footprint of the inert base spacer is positioned entirely within the footprint of the inert top spacer.

Abstract: A circuit for driving a display panel comprises a source driving circuit having a plurality of driving units for driving the display panel according to display data; at least one of the driving units has a buffer and a switch circuit wherein the buffer includes an input terminal and an output terminal, and the switch circuit is coupled to the buffer and used for selectively and electrically connecting the output terminal of the buffer and the display panel, electrically connecting the input terminal of the buffer and the display panel, or electrically disconnecting the buffer and the display panel. The present invention also provides a method for driving a display panel.

Abstract: The present invention relates to a data driving system and method for driving a panel. The data driving system comprises: a gamma voltage supply and a D/A converter. The gamma voltage supply produces a plurality of gamma voltages. The D/A converter receives the gamma voltages, a first pixel value and a second pixel value, and converts the first pixel value and the second pixel value to a corresponding gamma voltage in the gamma voltages. When the D/A converter converts the first pixel value, the gamma voltages have a first polarity offset. When the D/A converter converts the second pixel value, the gamma voltages have a second polarity offset. Because the data driving system of the invention periodically switches the first polarity offset and the second polarity offset of the gamma voltage supply, an offset in the driving voltage is eliminated by the first polarity (positive) offset and the second polarity (negative) offset in space and time. Therefore, there is no band mura in the panel.