Abstract: A method includes forming a transistor over a substrate; forming a front-side interconnection structure over the transistor; after forming the front-side interconnection structure, removing the substrate; after removing the substrate, forming a backside via to be electrically connected to the transistor; depositing a dielectric layer to cover the backside via; forming an opening in the dielectric layer to expose the backside via; forming a spacer structure on a sidewall of the opening; after forming a spacer structure, forming a conductive feature in the opening to be electrically connected to the backside via; and after forming the conductive feature, forming an air gap in the spacer structure.

Abstract: An electronic device is provided. The electronic device includes a plurality of units. The plurality of units includes a first unit. The first unit includes a first electronic component and a test circuit. The test circuit is electrically connected to the first electronic component. The test circuit includes a coil circuit.

Abstract: The present disclosure describes a method to form a backside power rail (BPR) semiconductor device with an air gap. The method includes forming a fin structure on a first side of a substrate, forming a source/drain (S/D) region adjacent to the fin structure, forming a first S/D contact structure on the first side of the substrate and in contact with the S/D region, and forming a capping structure on the first S/D contact structure. The method further includes removing a portion of the first S/D contact structure through the capping structure to form an air gap and forming a second S/D contact structure on a second side of the substrate and in contact with the S/D region. The second side is opposite to the first side.

Abstract: Semiconductor devices and methods of forming the same are provided. A semiconductor device according to one embodiment includes an active region including a channel region and a source/drain region adjacent the channel region, a gate structure over the channel region of the active region, a source/drain contact over the source/drain region, a dielectric feature over the gate structure and including a lower portion adjacent the gate structure and an upper portion away from the gate structure, and an air gap disposed between the gate structure and the source/drain contact. A first width of the upper portion of the dielectric feature along a first direction is greater than a second width of the lower portion of the dielectric feature along the first direction. The air gap is disposed below the upper portion of the dielectric feature.

Abstract: A semiconductor device structure includes a source/drain feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a dielectric layer having a continuous surface in contact with the entire second surface of the source/drain feature, a semiconductor layer having a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface, wherein the sidewall of the semiconductor layer is in contact with the sidewall of the source/drain feature. The structure also includes a gate dielectric layer in contact with the continuous surface of the dielectric layer and the second surface of the semiconductor layer, and a gate electrode layer surrounding a portion of the semiconductor layer.

Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a device, a first dielectric material disposed over the device, and an opening is formed in the first dielectric material. The semiconductor device structure further includes a conductive structure disposed in the opening, and the conductive structure includes a first sidewall. The semiconductor device structure further includes a surrounding structure disposed in the opening, and the surrounding structure surrounds the first sidewall of the conductive structure. The surrounding structure includes a first spacer layer and a second spacer layer adjacent the first spacer layer. The first spacer layer is separated from the second spacer layer by an air gap.

Abstract: An image capturing unit includes an imaging element and a dual-shot injection-molded optical folding element that are adjacent to each other. The imaging element is configured for an imaging light to pass through. The dual-shot injection-molded optical folding element includes a first part and a second part. The first part is made of transparent material. The first part has a reflective surface configured to reflect the imaging light. The second part is made of opaque material, and the second part is fixed at periphery of the first part. The second part includes a supporting portion configured to support the dual-shot injection-molded optical folding element. The supporting portion maintains the dual-shot injection-molded optical folding element at a predetermined position corresponding to the imaging element through mechanism assembly.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first insulating layer over a substrate. A first metal feature is formed in the first insulating layer and a second insulating layer is formed over the first insulating layer. A first metal via is formed through the second insulating layer to connect the first metal feature. A second metal feature is formed over the second insulating layer. The second metal feature has a convex top surface and a plane bottom surface, and the plane bottom is electrically connected to the first metal feature through the first metal via.

Abstract: A semiconductor structure includes one or more channel layers; a gate structure engaging the one or more channel layers; a first source/drain feature connected to a first side of the one or more channel layers and adjacent to the gate structure; a first dielectric cap disposed over the first source/drain feature, wherein a bottom surface of the first dielectric cap is below a top surface of the gate structure; a first via disposed under and electrically connected to the first source/drain feature; and a power rail disposed under and electrically connected to the first via.

Abstract: Semiconductor devices and methods of forming the same are provided. In one embodiment, a semiconductor device includes a gate structure sandwiched between and in contact with a first spacer feature and a second spacer feature, a top surface of the first spacer feature and a top surface of the second spacer feature extending above a top surface of the gate structure, a gate self-aligned contact (SAC) dielectric feature over the first spacer feature and the second spacer feature, a contact etch stop layer (CESL) over the gate SAC dielectric feature, a dielectric layer over the CESL, a gate contact feature extending through the dielectric layer, the CESL, the gate SAC dielectric feature, and between the first spacer feature and the second spacer feature to be in contact with the gate structure, and a liner disposed between the first spacer feature and the gate contact feature.

Abstract: Semiconductor devices including air spacers formed in a backside interconnect structure and methods of forming the same are disclosed. In an embodiment, a device includes a first transistor structure; a front-side interconnect structure on a front-side of the first transistor structure; and a backside interconnect structure on a backside of the first transistor structure, the backside interconnect structure including a first dielectric layer on the backside of the first transistor structure; a first via extending through the first dielectric layer, the first via being electrically coupled to a first source/drain region of the first transistor structure; a first conductive line electrically coupled to the first via; and an air spacer adjacent the first conductive line, the first conductive line defining a first side boundary of the air spacer.

Abstract: The present disclosure relates to a technical field of camera modules, and in particular to a stabilizing-focusing motor and an application module thereof. The stabilizing-focusing motor includes a stabilizing structure and a focusing structure, where the stabilizing structure includes an outer ball holder, an inner ball holder, balls, a stabilizing magnet, a stabilizing coil, and a stabilizing circuit board; and the focusing structure includes a second magnet holder, a lens carrier, a connecting spring, a focusing magnet, a focusing coil, and a focusing circuit board. The present disclosure can provide a multi-axis degree of freedom (DOF), reduce a power consumption and a size of a micro gimbal stabilizer (MGS) camera module, lessen impacts of an attitude error on stabilization performance, make assembly less difficult, and increase a maximum stabilizing angle.

Abstract: A non-sensor type closed-loop stabilization control algorithm comprises the following steps: 1, reading all voltages Vk?1 and currents Ik?1 for driving a multi-axis stabilization motor; 2, calculating and outputting all coil resistances Rk?1 in the multi-axis stabilization motor; 3, reading all the coil resistances, voltages and currents in the steps 1 and 2, and calculating and outputting counter electromotive force Ek?1 of all the coils in the multi-axis stabilization motor; 4, reading an stabilization compensation angle ?k, each coil resistance and the counter electromotive force, and calculating and outputting a closed-loop stabilization control Fk; and 5, then waiting for a time step k=k+1, and repeating the steps in the steps 1 to 4. It aims to add a closed-loop control element to a motor without a sensor to achieve an excellent stabilization effect and to reduce the risk of image blurring caused by resonance.

Abstract: A micro gimbal stabilizer (MGS) camera module includes an MGS and a camera module, where the MGS includes gimbal drive assemblies, a movable gimbal portion, and a static gimbal portion movably connected to the movable gimbal portion; a gimbal magnet is provided on the movable gimbal portion; the camera module includes a movable focusing portion, a static focusing portion, a focusing drive assembly, and a focusing feedback assembly; the static focusing portion is relatively fixed with the movable gimbal portion; and a position magnet is provided on the static focusing portion. In response to a focusing process of the camera module, the focusing position sensor is relatively fixed with the gimbal magnet and the focusing magnet, which can effectively reduce influences of magnetic fields of the gimbal magnet and the focusing magnet on the focusing position sensor.

Abstract: This document describes systems and techniques for simulating the touch of a human finger in manipulating an interface device, such as a touchscreen included in a mobile phone or other computing device. The systems and techniques include an artificial finger configured to be received and manipulated by a robotic actuator to simulate surface engagement, mechanical force, and electrical conductivity of a human finger engaging the touchscreen at varied touch angles and/or mechanical pressures. The systems and techniques thereby provide for rigorous and repeatable testing of an electrical and mechanical response of the touchscreen to simulated user inputs without involving a human test operator.

Abstract: A camera stabilizer module includes a fixed structure including at least two split outer ball seats, where rotating fulcrums are provided on each of the outer ball seats, and there are at least four rotating fulcrums in total; a first circuit board provided with a fixed portion, an elastic portion and a connecting portion that are sequentially connected; a plurality of balls quantitatively consistent with the rotating fulcrums and rotatably connected to the rotating fulcrums in one-to-one correspondence; a movable structure provided in the outer ball seats; and a driving structure capable of driving the movable structure to rotate around at least two rotational axes.

Abstract: Disclosed are a spring stabilizer system and a lens stabilizing-focusing device using the system. The spring stabilizer system includes at least two stabilizing springs, where the stabilizing springs each include a fixed portion, an elastic connecting arm, and a movable arm; a first connecting groove is formed in the fixed portion; one end of the elastic connecting arm is connected to the first connecting groove; a ratio of a length of a vertical midline of the elastic connecting arm to a maximum distance from an edge of the elastic connecting arm to the vertical midline is greater than 5:1; a ratio of a width of the elastic connecting arm to a thickness of the elastic connecting arm is not less than 2:1; a second connecting groove is formed in the movable portion; and the second connecting groove is connected to the other end of the elastic connecting arm.

Abstract: A circuit board having multiple degrees of freedom, comprises a flat board and a conductive and flexible unit disposed on the flat board. The conductive and flexible unit comprises: an inner support plate, an outer support plate, and at least one flexible connector; a hollow portion is provided on the outer support plate; the inner support plate and the flexible connector are disposed in the hollow portion; the inner and the outer support plates are connected by the flexible connector; the flexible connector comprises an outer connecting portion, an inner connecting portion corresponding to the outer connecting portion, and an extension located between the outer connecting portion and the inner connecting portion. The circuit board has a simple and compact structure; the production efficiency is high; costs are low; a multi-axis flexible anti-shaking effect can be achieved without folding a flexible structure; the resilience performance is good.

Abstract: A magnet arrangement structure suitable for a voice coil motor is provided by the present invention, comprise a magnet holder and a coil holder coaxial with the magnet holder, wherein 2n groups of magnets are provided on the magnet holder, each group of magnets is symmetrically provided around a central axis of the magnet holder, each group of magnets comprises at least one magnet, and each magnet has two magnetic poles; the surfaces facing the central axis of each group of magnets comprise two different magnetic poles, and each magnetic pole is opposite to the magnetic pole; and each group of magnets also corresponds to a coil. Compared with the traditional art, the magnetic field intensity passing through the coil can be improved, power consumption is reduced, electromagnetic force is increased, and the benefits of reducing weight, cost and size of the motor are achieved.