Abstract: A semiconductor device structure includes a source/drain feature comprising a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface. The structure also includes a dielectric layer having a continuous surface in contact with the entire second surface of the source/drain feature, a semiconductor layer having a first surface, a second surface opposing the first surface, and a sidewall connecting the first surface to the second surface, wherein the sidewall of the semiconductor layer is in contact with the sidewall of the source/drain feature. The structure also includes a gate dielectric layer in contact with the continuous surface of the dielectric layer and the second surface of the semiconductor layer, and a gate electrode layer surrounding a portion of the semiconductor layer.

Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.

Abstract: A modularized wireless earphone includes an inner module, a power supply unit, a loudspeaker and an outer casing. The inner module is provided with a circuit module and an insulated casing. The circuit module includes a detection juncture used for detecting, an ANT sensor, a receiving microphone and a control switch. The detection juncture, the ANT sensor, the receiving microphone and the control switch are interconnected electrically. The insulated casing is used to enclose the circuit module and expose the detection juncture, the receiving microphone and the control switch outside an insulation body. The power supply unit is interconnected with the circuit module electrically to provide electricity, the loudspeaker is interconnected with the circuit module electrically, and the outer casing is used to enclose the inner module, the power supply unit and the loudspeaker.

Abstract: A modularized wireless earphone includes an inner module, a power supply unit, a loudspeaker and an outer casing. The inner module is provided with a circuit module and an insulated casing. The circuit module includes a detection juncture used for detecting, an ANT sensor, a receiving microphone and a control switch. The detection juncture, the ANT sensor, the receiving microphone and the control switch are interconnected electrically. The insulated casing is used to enclose the circuit module and expose the detection juncture, the receiving microphone and the control switch outside an insulation body. The power supply unit is interconnected with the circuit module electrically to provide electricity, the loudspeaker is interconnected with the circuit module electrically, and the outer casing is used to enclose the inner module, the power supply unit and the loudspeaker.

Abstract: A method for manufacturing a flat heat pipe with sectional differences includes following steps. First, form a plurality of grooves on an inner wall of a pipe body having one outer diameter. Subsequently, form a plurality of tubular sectional difference portions having various outer diameters on the pipe body. Then, degass an interior of the pipe body into vacuum and seal both ends thereof. Finally, press the respective sectional difference portions of the pipe body into flat.

Abstract: The present invention provides a flat heat pipe with sectional differences and a method for manufacturing the same. The heat pipe has a flat hollow pipe body. A working fluid is sealed in the pipe body. The pipe body is provided along its length with a plurality of flat sectional difference portions having different widths. A connecting portion is formed between the sectional difference portions. The inner wall of the pipe body is formed with a plurality of grooves. The pitch between the grooves in the sectional difference portion of a relatively large width is larger than the pitch between the grooves in the sectional difference portion of a relatively small width.

Abstract: A drawer assembly includes four side boards and each of the side boards has at lease one lug on two ends and one of two sides thereof, and a bottom board which has lugs one four sides thereof. The four side boards are connected to be a four-side frame by connecting the at least one lugs by four pins. The four-side frame is connected to the bottom board by connecting the at least one lugs of the four-side frame to the lugs on the four sides of the bottom board. The drawer assembly requires no tools or welding machine to assemble a drawer within a short period of time.

Abstract: A method of manufacturing a printed circuit board (PCB) having wiring layers electrically connected via solid cylindrical copper interconnecting bodies includes the following steps: locally providing on a base or an insulated layer with a first copper foil wiring layer; fully coating the first wiring layer with a conductive layer; coating areas on the first wiring layer that are not used for interconnection purpose with a layer of dry-film resist to expose other areas on the first wiring layer to be used for interconnection purpose; removing the conductive layer by micro etching; forming solid cylindrical copper interconnecting bodies of a desired height on the interconnecting areas through electric plating; removing the dry-film resist, so that the solid cylindrical copper interconnecting bodies consisting of pure copper project from the interconnecting areas; and providing a second wiring layer over the first wiring layer.