Patents by Inventor Lin-Gi Yang

Lin-Gi Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 7737538
    Abstract: A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: June 15, 2010
    Assignee: VisEra Technologies Company Limited
    Inventors: Chao-Chen Chen, Lin-Gi Yang, Chia-Chi Chou, Shih-Chieh Teng
  • Semiconductor package
    Publication number: 20090121303
    Abstract: A semiconductor package. The semiconductor package of the invention comprises: a substrate comprising at least one exposed area with photosensitive devices; a cover for isolating the exposed area from the external atmosphere, wherein one of either the substrate or the cover is a base, and the other is a top structure; and a dam formed on the base to form a cavity, wherein the top of the dam has a recess, the dam is attached the top structure by an adhesive, and the cavity corresponds to the exposed area.
    Type: Application
    Filed: November 8, 2007
    Publication date: May 14, 2009
    Inventors: Chao-Chen Chen, Lin-Gi Yang, Chia-Chi Chou, Shih-Chieh Teng