Patents by Inventor Lin Hsien Chu

Lin Hsien Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030231139
    Abstract: A wide band antenna (1) includes a printed circuit board (2), a dipole (6) mounted on the printed circuit board and a feeder apparatus (5) through which the dipole is fed. The dipole includes a first pole (3) and a second pole (4) spaced apart from the first pole. The first pole forms a middle portion (33), a first portion (31), and a second portion (32), and the first and the second portions respectively extend rearwardly from two opposite ends of the middle portion. A length of the first portion differs from a length of the second portion. The second pole is a bar microstrip adjacent to the middle portion, but a gap is formed therebetween. The first portion and the second portion can separately transfer signals, to allow the antenna to operate in two different wide band frequency bands.
    Type: Application
    Filed: November 18, 2002
    Publication date: December 18, 2003
    Inventors: Lung-Sheng Tai, Lin Hsien Chu
  • Publication number: 20020005811
    Abstract: A planar printed circuit antenna (1) comprises a printed circuit board (PCB) (10) mounted on an insulative substrate (100), a plurality of electronic dipole units (20) and a coaxial feeder element (30). The PCB comprises an upper layer (101), and a lower layer (102) opposite the upper layer and fixed on the insulative substrate. The coaxial feeder element includes an RF cable (305), and a neck (303) securely attached around the RF cable for engaging the coaxial feeder element with the substrate. The RF cable has a conducting core wire (301) connected to the upper layer via a jumper wire (304), and an outer conductor (302) around the conducting core wire directly connected to the lower layer. The electronic dipole units are respectively arranged on the upper and lower layers of the PCB, and are respectively coupled to the conducting core wire and the outer conductor. The PCB has space available for accommodating the jumper wire of varying length. The jumper wire has an insulative coating.
    Type: Application
    Filed: December 28, 2000
    Publication date: January 17, 2002
    Inventors: Szu-Nan Tsai, Chung-Yen Yang, Lin Hsien Chu