Patents by Inventor Lin Hsu

Lin Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10600692
    Abstract: A semiconductor device includes a substrate having a fin structure extending along a first direction. The fin structure protrudes from a top surface of a trench isolation region and has a first height. A plurality of gate lines including a first gate line and a second gate line extend along a second direction and striding across the fin structure. The first gate line has a discontinuity directly above a gate cut region. The second gate line is disposed in proximity to a dummy fin region, and does not overlap with the dummy fin region. The fin structure has a second height within the dummy fin region, and the second height is smaller than the first height.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: March 24, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsiao-Lin Hsu, En-Chiuan Liou
  • Publication number: 20200076882
    Abstract: One or both of a metadata associated with content to be integrated into a linear broadcast and a content data comprising content to be integrated into the linear broadcast is received via a network. A trigger to integrate content into said linear broadcast is received from a broadcast automation system associated with the linear broadcast. Based at least in part on said metadata a content item is determined to be integrated into the linear broadcast in response to the trigger. The determined content item is integrated into the linear broadcast, including by providing to a mixing node associated with the linear broadcast a broadcast-ready audio output.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 5, 2020
    Inventors: Jateen P. Parekh, Yuri Regelman, Bo-Lin Hsu, John Paul LeFlohic
  • Publication number: 20200077072
    Abstract: A method and a system for information display are proposed. The system includes a light transmissive display, at least one first information extraction device, at least one second information extraction device, and a processing device, where the processing device is connected to the display, the first information extraction device, and the second information extraction device. The first information extraction device is configured to obtain position information of a user. The second information extraction device is configured to obtain position information of a target. The processing device is configured to perform coordinate transformation on the position information of the user and the position information of the object to generate fused information between the user and the target, and to display related information of the object on the display according to the fused information.
    Type: Application
    Filed: March 21, 2019
    Publication date: March 5, 2020
    Applicants: Industrial Technology Research Institute, Intellectual Property Innovation Corporation
    Inventors: Wei-Lin Hsu, Tzu-Yi Yu, Heng-Yin Chen
  • Publication number: 20200062285
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle, a supporting structure, and a first sensor. The wheeled trolley is above a rail of the rail system, is operable to move over the rail, and has a bottom surface. The overhead vehicle body is suspended by the wheeled trolley and below the rail. The supporting structure connects the wheeled trolley and the overhead vehicle body. The first sensor is on the bottom surface of the wheeled trolley and is configured to detect a first parameter of the rail of the rail system.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung CHIEN, Jen-Ti WANG, Fu-Hsien LI, Chih-Hung LIU, Yung-Lin HSU
  • Publication number: 20200059054
    Abstract: The present invention relates to an electronic device and an antenna connector. The electronic device includes a first unit, a transmission dock, a base, and an antenna connector. The transmission dock is pivotally provided at the first unit. The base is movably provided at the transmission dock, and includes a top plate and a bottom plate that are mutually fixed. The antenna connector is movably provided at the base, and includes a housing, an installation flange, a central moving terminal and an elastic member. The central moving terminal is located in the housing. The installation flange is radially formed outside the housing, and is located between the top plate and the bottom plate and abuts against the top plate. The elastic member is clamped between the installation flange and the bottom plate.
    Type: Application
    Filed: January 31, 2019
    Publication date: February 20, 2020
    Inventors: WAN-LIN HSU, JUEI-CHI CHANG, KUN-CHENG LEE
  • Publication number: 20200058611
    Abstract: A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.
    Type: Application
    Filed: January 28, 2019
    Publication date: February 20, 2020
    Inventors: Chih-Hao LIN, Chien-Kuo CHANG, Tzu-Kai LAN, Chung-Chih CHEN, Jr-Lin HSU
  • Patent number: 10564632
    Abstract: In an embodiment an automated material handling system (AMHS) for a semiconductor fabrication facility (FAB) includes: a sensor supported by a rail, wherein the sensor is configured to collect sensor data characterizing a vehicle that moves along the rail, wherein the vehicle is configured to carry at least one wafer; and a monitoring module configured to: detect a trigger event based on the sensor data, and initiate a remediation action in response to the trigger event.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: February 18, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yung-Lin Hsu, Richard Lin, Chiung-Min Lin, Alan Yang
  • Publication number: 20200013724
    Abstract: A method of forming an overlay mark structure includes the following steps. An insulation layer is formed on a substrate. A first overlay mark is formed in the insulation layer. A metal layer is formed on the substrate. The metal layer covers the insulation layer and the first overlay mark. The metal layer on the first overlay mark is removed. A top surface of the first overlay mark is lower than a top surface of the insulation layer after the step of removing the metal layer on the first overlay mark. A second overlay mark is formed on the metal layer. In the method of forming the overlay mark structure, the first overlay mark may not be covered by the metal layer for avoiding influences on related measurements, and the second overlay mark may be formed on the metal layer for avoiding related defects generated by the height difference.
    Type: Application
    Filed: July 31, 2018
    Publication date: January 9, 2020
    Inventors: Zheng-Feng Chen, Sho-Shen Lee, En-Chiuan Liou, Hsiao-Lin Hsu, Yi-Ting Chen, Lu-Wei Kuo
  • Patent number: 10529667
    Abstract: A method of forming an overlay mark structure includes the following steps. An insulation layer is formed on a substrate. A first overlay mark is formed in the insulation layer. A metal layer is formed on the substrate. The metal layer covers the insulation layer and the first overlay mark. The metal layer on the first overlay mark is removed. A top surface of the first overlay mark is lower than a top surface of the insulation layer after the step of removing the metal layer on the first overlay mark. A second overlay mark is formed on the metal layer. In the method of forming the overlay mark structure, the first overlay mark may not be covered by the metal layer for avoiding influences on related measurements, and the second overlay mark may be formed on the metal layer for avoiding related defects generated by the height difference.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: January 7, 2020
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Zheng-Feng Chen, Sho-Shen Lee, En-Chiuan Liou, Hsiao-Lin Hsu, Yi-Ting Chen, Lu-Wei Kuo
  • Patent number: 10522597
    Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 31, 2019
    Assignee: E Ink Holdings Inc.
    Inventors: Kuan-Yi Lin, Yu-Wen Chen, Yu-Chieh Hung, Chun-Yu Lu, Wen-Chung Tang, Po-Wei Chen, Yu-Lin Hsu
  • Patent number: 10510830
    Abstract: An N-type polysilicon crystal, a manufacturing method thereof, and an N-type polysilicon wafer are provided. The N-type polysilicon crystal has a slope of resistivity and a slope of defect area percentage. When the horizontal axis is referred to solidified fraction and the vertical axis is referred to resistivity presented by a unit of Ohm·cm (?·cm), the slope of resistivity is 0 to ?1.8 at the solidified fraction of 0.25 to 0.8. When the horizontal axis is referred to solidified fraction and the vertical axis is referred to defect area percentage (%), the slope of defect area percentage is less than 2.5 at the solidified fraction of 0.4 to 0.8.
    Type: Grant
    Filed: September 2, 2018
    Date of Patent: December 17, 2019
    Assignee: Sino-American Silicon Products Inc.
    Inventors: Ching-Hung Weng, Cheng-Jui Yang, Yu-Min Yang, Yuan-Hsiao Chang, Bo-Kai Wang, Wen-Huai Yu, Ying-Ru Shih, Sung-Lin Hsu
  • Patent number: 10504778
    Abstract: An embodiment contact plug includes a bilayer structure and a diffusion barrier layer on a sidewall and a bottom surface of the bilayer structure. The bilayer structure includes a conductive core and a conductive liner on a sidewall and a bottom surface of the conductive core. In the embodiment contact plug, the conductive liner comprises cobalt or ruthenium.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: December 10, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Lin, Sheng-Hsuan Lin, Chih-Wei Chang, You-Hua Chou, Chia-Lin Hsu
  • Publication number: 20190371636
    Abstract: A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.
    Type: Application
    Filed: May 29, 2018
    Publication date: December 5, 2019
    Inventors: Chun-Jung HUANG, Yung-Lin HSU, Kuang-Huan HSU, Wei-Chih CHEN, Jen-Ti WANG, Chih-Hung LIU
  • Patent number: 10497626
    Abstract: A method of forming a semiconductor device includes forming a gate dielectric layer on a substrate; forming a barrier layer over the gate dielectric layer; treating the barrier layer to roughen an outer surface of the barrier layer, resulting in a treated barrier layer; and forming a metal layer over the treated barrier layer.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: December 3, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yen-Ting Chen, Chia-Lin Hsu
  • Patent number: 10464583
    Abstract: A monitor vehicle for a rail system includes a wheeled trolley, an overhead vehicle body, at least one supporting structure, and at least one first sensor. The wheeled trolley is operable to move over one or more rails of the rail system. The supporting structure connects the wheeled trolley and overhead vehicle body. The first sensor is on the wheeled trolley and configured to detect at least one first parameter of the one or more rails of the rail system.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: November 5, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hung Chien, Jen-Ti Wang, Fu-Hsien Li, Chih-Hung Liu, Yung-Lin Hsu
  • Publication number: 20190324363
    Abstract: A projection screen configured to be projected with multi-angle images includes a base membrane and a coating layer. The base membrane includes a body layer and a plurality of toothed portions connected with the body layer. A profile of each of the toothed portions includes at least one first plane and at least one second plane, where the first plane and the second plane each has a reflection angle different from each other, for providing multi-angle images of projection. The coating layer includes a reflection layer and a light-absorbing layer, where the reflection layer is disposed on the profile of each of the toothed portions; whereas the light-absorbing layer is disposed on the reflection layer, such that, as viewed from a projection position, the coating layer is disposed behind the base membrane.
    Type: Application
    Filed: November 5, 2018
    Publication date: October 24, 2019
    Inventors: Chia-Chen Ku, Rong-Lin Hsu
  • Patent number: 10447768
    Abstract: One or both of a metadata associated with content to be integrated into a linear broadcast and a content data comprising content to be integrated into the linear broadcast is received via a network. A trigger to integrate content into said linear broadcast is received from a broadcast automation system associated with the linear broadcast. Based at least in part on said metadata a content item is determined to be integrated into the linear broadcast in response to the trigger. The determined content item is integrated into the linear broadcast, including by providing to a mixing node associated with the linear broadcast a broadcast-ready audio output.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: October 15, 2019
    Assignee: Jelli, Inc.
    Inventors: Jateen P. Parekh, Yuri Regelman, Bo-Lin Hsu, John Paul LeFlohic
  • Publication number: 20190310314
    Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.
    Type: Application
    Filed: March 20, 2019
    Publication date: October 10, 2019
    Inventors: Chih-Yang Liu, Ying-Chou Shih, Yen-Ju Lu, Chih-Ming Hung, Jui-Lin Hsu
  • Patent number: 10437291
    Abstract: An engaging mechanism, a transmission dock equipped with the same, and an electronic apparatus having the same are provided. The engaging mechanism includes a rotary fastening element, a guiding frame and a translating frame. The rotary fastening element rotates about an axis to reach an engaging state. The guiding frame has two opposing outer sidewalls and is protrudingly disposed on a support surface of the transmission dock. The axis is substantially parallel to the support surface. The rotary fastening element protrudes from one of the outer sidewalls in the engaging state. The translating frame has two opposing inner sidewalls and two opposing upper wall surfaces. The two outer sidewalls are disposed between the two inner sidewalls, allowing the rotary fastening element to rotate and reach the engaging state and thereby stop one of the upper wall surfaces, when the translating frame connects with the support surface.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: October 8, 2019
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventors: Wan-Lin Hsu, Juei-Chi Chang
  • Patent number: 10395999
    Abstract: A method for monitoring fin removal includes providing a substrate having a first region with first fins extending along a first direction and a second region with second fins extending along a second direction, wherein the first direction is perpendicular to the second direction; forming a material layer on the substrate to cover the first fins and the second fins; identically patterning the first fins and the second fins using a first pattern and a second pattern respectively for simultaneously removing parts of the first and second fins, thereby forming first fin features in the first region and second fin features in the second region, wherein the first pattern has a first dimension along the second direction, the second pattern has a second dimension along the second direction, and the second dimension is equal to the first dimension; and monitoring the first fin features using the second fin features.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: August 27, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Hao Yang, En-Chiuan Liou, Hsiao-Lin Hsu, Tang-Chun Weng, Chia-Ching Lin, Yen-Pu Chen