Patents by Inventor Lin Hung Kai

Lin Hung Kai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer transportation
    Patent number: 10262882
    Abstract: A method includes causing a carrier of an overhead hoist transfer system (OHT) to latch onto a top latch of a first semiconductor wafer transportation pod, the first semiconductor wafer transportation pod comprising a top latching mechanism configured to selectively connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, and a bottom latching mechanism configured to selectively connect to another pod. The method further includes rotating the first semiconductor wafer transportation pod such that the top latching mechanism of the first semiconductor wafer transportation pod latches on to a second semiconductor wafer transportation pod.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: April 16, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Yao Hsieh, Shao-Hao Chiu, Wen-Kai Hsieh, Lin Hung Kai, Si-Heng Liu
  • Semiconductor Wafer Transportation
    Publication number: 20180108550
    Abstract: A method includes causing a carrier of an overhead hoist transfer system (OHT) to latch onto a top latch of a first semiconductor wafer transportation pod, the first semiconductor wafer transportation pod comprising a top latching mechanism configured to selectively connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, and a bottom latching mechanism configured to selectively connect to another pod. The method further includes rotating the first semiconductor wafer transportation pod such that the top latching mechanism of the first semiconductor wafer transportation pod latches on to a second semiconductor wafer transportation pod.
    Type: Application
    Filed: December 15, 2017
    Publication date: April 19, 2018
    Inventors: Wen-Yao Hsieh, Shao-Hao Chiu, Wen-Kai Hsieh, Lin Hung Kai, Si-Heng Liu
  • Semiconductor wafer transportation
    Patent number: 9852934
    Abstract: A wafer transportation pod includes a body, a main compartment enclosed by the body, the main compartment to provide a controlled environment, a holding device within the main compartment, the holding device to hold a plurality of semiconductor wafers, a top latching mechanism configured to connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, a bottom latching mechanism configured to connect to another pod, the bottom latching mechanism being similar to the latching mechanism on the carrier.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: December 26, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Yao Hsieh, Wen-Kai Hsieh, Si-Heng Liu, Lin Hung Kai, Shao-Hao Chiu
  • Semiconductor Wafer Transportation
    Publication number: 20150235883
    Abstract: A wafer transportation pod includes a body, a main compartment enclosed by the body, the main compartment to provide a controlled environment, a holding device within the main compartment, the holding device to hold a plurality of semiconductor wafers, a top latching mechanism configured to connect to another pod or a carrier mechanism of an overhead hoist transfer (OHT) system, a bottom latching mechanism configured to connect to another pod, the bottom latching mechanism being similar to the latching mechanism on the carrier.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 20, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Yao Hsieh, Wen-Kai Hsieh, Si-Heng Liu, Lin Hung Kai, Shao-Hao Chiu