Patents by Inventor Lin-Jen Lin

Lin-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections
    Publication number: 20110233766
    Abstract: A semiconductor device has a substrate with a contact pad. A first insulation layer is formed over the substrate and contact pad. A first under bump metallization (UBM) is formed over the first insulating layer and is electrically connected to the contact pad. A second insulation layer is formed over the first UBM. A second UBM is formed over the second insulation layer after the second insulation layer is cured. The second UBM is electrically connected to the first UBM. The second insulation layer is between and separates portions of the first and second UBMs. A photoresist layer with an opening over the contact pad is formed over the second UBM. A conductive bump material is deposited within the opening in the photoresist layer. The photoresist layer is removed and the conductive bump material is reflowed to form a spherical bump.
    Type: Application
    Filed: February 17, 2011
    Publication date: September 29, 2011
    Applicant: STATS CHIPPAC, LTD.
    Inventors: Lin-Jen Lin, Stephen A. Murphy, Wei Sun