Patents by Inventor Lin Jen TSAI

Lin Jen TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11539049
    Abstract: The present invention provides a silicon-carbon composite which contains a body having a core-shell structure and a polymer modification layer. The core of the body contains a silicon-containing particle. The shell of the body is a carbon encapsulation layer. The polymer modification layer is located on the external surface of the shell of the body and encapsulates the body. The polymer modification layer comprises a polymer selected from the group consisting of polyester, polyfluorocarbon, polyvinyl alcohol, polyacrylic acid, cellulose and a combination thereof.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 27, 2022
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Lin Jen Tsai, Chiyu Huang, Chihhsien Wang
  • Publication number: 20200083526
    Abstract: A silicon-carbon composite material includes a silicon-containing particle, a carbon covering layer enclosing the silicon-containing particle, and a conductive material included in at least one of the silicon-containing particle and the carbon covering layer. A ratio of an integral area of a characteristic peak of sp2 carbon in an X-ray photoelectron spectrum of the silicon-carbon composite material to a total integral area of characteristic peaks of C1s orbital in the X-ray photoelectron spectrum is in a range from 0.7 to 0.9.
    Type: Application
    Filed: May 30, 2019
    Publication date: March 12, 2020
    Inventors: Lin-Jen TSAI, Chih-Hsien WANG
  • Publication number: 20200044255
    Abstract: The present invention provides a silicon-carbon composite which contains a body having a core-shell structure and a polymer modification layer. The core of the body contains a silicon-containing particle. The shell of the body is a carbon encapsulation layer. The polymer modification layer is located on the external surface of the shell of the body and encapsulates the body. The polymer modification layer comprises a polymer selected from the group consisting of polyester, polyfluorocarbon, polyvinyl alcohol, polyacrylic acid, cellulose and a combination thereof.
    Type: Application
    Filed: July 31, 2019
    Publication date: February 6, 2020
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: LIN JEN TSAI, CHIYU HUANG, CHIHHSIEN WANG
  • Patent number: 9613757
    Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: April 4, 2017
    Assignee: ETERNAL MATERIALS CO., LTD.
    Inventors: Lin Jen Tsai, Shinn-Horng Chen, Chieh-Fu Lin
  • Publication number: 20140036415
    Abstract: The invention pertains to a conductive polymer composite comprising: (a) a conductive polymer and (b) a polyanion, wherein the conductive polymer comprises polymerized units derived from a monomer of formula (I): wherein: A is a C1-C4 alkylene group substituted with (R)p; X is O or S; R is H, an unsubstituted or substituted C1-C20 alkyl or alkoxy, or an unsubstituted or substituted C6-C20 aryl; and p is 0, 1, or 2, and the conductive polymer has a weight average molecular weight ranging from 3,000 to 30,000. A process for preparing the conductive polymer composite is also provided.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 6, 2014
    Applicants: GEMMY ELECTRONIC CO., LTD., ETERNAL CHEMICAL CO., LTD.
    Inventors: Lin Jen TSAI, Shinn-Horng CHEN, Chieh-Fu LIN