Abstract: A method for creating an optimized gradient mesh of a vector-based image from a raster-based image. In one implementation, a set of boundaries for an object on a raster-based image may be received. An initial gradient mesh of the object may be created. A residual energy between the object on the raster-based image and a rendered initial gradient mesh may be minimized to generate an optimized gradient mesh.

Abstract: An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate.

Abstract: The present invention provides a nano-ranged wide color gamut and environmental-friendly UV inkjet printing system for a hard substrate comprising a carrier, an ink supplier, a printing head and a controller. The carrier receives the hard substrate thereon and the ink supplier includes a container space for containing an ink. The color gamut of the ink comprises basic colors of RYBK. The printing head receives the ink from the ink supplier, and the controller generates a control signal to control the printing head to spray coating the ink onto the surface of the hard substrate directly. The present invention is able to print the ink directly onto the surface of the hard substrate while utilizing the UV light for curing the ink into solid. The ink exhibits the physical properties of low surface tension, nano particles, environmental friendly, UV excitable, short duration of drying, great adhesiveness and high transparency.

Abstract: A three-dimensional shape parameter computation system and method for computing three-dimensional human head shape parameters from two-dimensional facial feature points. A series of images containing a user's face is captured. Embodiments of the system and method deduce the 3D parameters of the user's head by examining a series of captured images of the user over time and in a variety of head poses and facial expressions, and then computing an average. An energy function is constructed over a batch of frames containing 2D face feature points obtained from the captured images, and the energy function is minimized to solve for the head shape parameters valid for the batch of frames. Head pose parameters and facial expression and animation parameters can vary over each captured image in the batch of frames. In some embodiments this minimization is performed using a modified Gauss-Newton minimization technique using a single iteration.

Abstract: A face cartooning system is described. In one implementation, the system generates an attractive cartoon face or graphic of a user's facial image. The system extracts facial features separately and applies pixel-based techniques customized to each facial feature. The style of cartoon face achieved resembles the likeness of the user more than cartoons generated by conventional vector-based cartooning techniques. The cartoon faces thus achieved provide an attractive facial appearance and thus have wide applicability in art, gaming, and messaging applications in which a pleasing degree of realism is desirable without exaggerated comedy or caricature.

Abstract: A nano wide color gamut transparent environment-friendly inkjet ink composition used on a base, which comprises color paste, mixed solvent, resin and additive. The color paste is used for polymerizing red toner, yellow toner, blue toner and black toner having nanoparticles. The mixed solvent is used for diluting the ink composition and being a carrier of the ink composition. The resin is used for providing drip-drying, dispersity and glossiness of the ink composition. The ink composition of the invention can be used to achieve high permeability, wide color gamut, drip drying, low ink bleeding, and high resolution.

Abstract: A method of circuit layout by photosensitive environment-friendly ink, which is used in a printed circuit board having a copper foil layer. The method comprises: providing photosensitive environment-friendly ink; disposing a circuit layout pattern, and injecting the photosensitive environment-friendly ink on the copper foil layer according to the circuit layout pattern to form the printed circuit board having the circuit layout pattern thereon; exposing the printed circuit board under light to have the photosensitive environment-friendly ink reacted with ultraviolet light in the light; and copper cleaning and alkaline cleaning the copper foil layer to expose the circuit layout pattern corresponding to the photosensitive environment-friendly ink on the printed circuit board.

Abstract: Described is a technology in which face alignment data is obtained by processing an image using a component-based discriminative search algorithm. For each facial component, the search is guided by an associated directional classifier that determines how to move the facial component (if at all) to achieve better alignment relative to its corresponding facial component in the image. Also described is training of the classifiers.

Abstract: A method of recycling a control wafer having a low-k dielectric layer deposited thereon involves etching a portion of the low-k dielectric layer using a plasma resulting in a residual film of the low-k dielectric layer and byproduct particulates of carbon on the substrate. The residual dielectric film is removed by wet etching with a low polarization organic solvent that includes HF and a surfactant.

Abstract: A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing.

Abstract: An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate.

Abstract: A method for forming a shallow trench isolation (STI) structure with a predetermined target height is provided. A substrate having a pad oxide layer formed on the substrate is provided. A nitride-containing layer with a thickness is formed on the pad oxide. A STI structure is formed and extends through the nitride-containing layer, the pad oxide layer, into the substrate. The thickness of the nitride-containing layer is measured to calculate the height of STI structure according to a correlation between the thickness of the nitride-containing layer and the height of STI structure. A thickness of the top portion STI structure to be removed is determined according to the difference between the height of the STI structure and the predetermined target height and is removed in a first etching process. The nitride-containing layer is removed without etching the STI structure or the pad oxide layer in a second etching process.

Abstract: By exposing a process control wafer having a porous low-k-dielectric layer thereon in an HF-based low-k dielectric etching solvent comprising a dilating additive and a passivating additive, the pores in the low-k dielectric layer are dilated some of which connect with one another to form one or more continuous channels extending through the thickness of the dielectric layer and allowing the HF-based solvent to reach down to the substrate. Then the passivating additive component of the HF-based etching solvent forms a passivation layer at the dielectric layer and the substrate interface that protects substrate from the HF-based etchant.

Abstract: Methods and related systems are described relating to an inversion approach for interpreting the geophysical electromagnetic data. The inversion can be constrained by using a multiphase fluid flow simulator (incorporating pressure data if available) which simulates the fluid flow process and calculates the spatial distribution of the water saturation and the salt concentration, which are in turn transformed into the formation conductivity using a resistivity-saturation formula. In this way, the inverted invasion profile is consistent with the fluid flow physics and moreover accounts for gravity segregation effects. Jointly with the pressure data, the inversion estimates a parametric one-dimensional distribution of permeability and porosity. The fluid flow volume is directly inverted from the fluid-flow-constrained inversion of the electromagnetic data.

Abstract: Described is a technology in which face alignment data is obtained by processing an image using a component-based discriminative search algorithm. For each facial component, the search is guided by an associated directional classifier that determines how to move the facial component (if at all) to achieve better alignment relative to its corresponding facial component in the image. Also described is training of the classifiers.

Abstract: A method of recycling a control wafer having a dielectric layer deposited thereon involves removing most of the dielectric layer by plasma etching leaving a residual film of the dielectric and then removing the residual dielectric film by a wet etching process. The combination of the dry and wet etching provides effective removal of the dielectric material without damaging the wafer substrate and any residual wet etching byproduct particulate remaining on the wafer substrate is then removed by APM cleaning and scrubbing.

Abstract: Techniques for providing localized color transfer are disclosed. In some aspects, a user may select a source region of a source image and a destination region of a destination image. The source region and the destination region may be associated by a designator to create a color transfer pair. A localized color transfer based on the color style of the source region may be implemented to modify the destination region color style. Further aspects may include optimizing the destination image to reduce discontinuities resulting from the color transfer and enabling the user to select regions of the destination image which are not modified by localized color transfer.

Abstract: By exposing a process control wafer having a porous low-k-dielectric layer thereon in an HF-based low-k dielectric etching solvent comprising a dilating additive and a passivating additive, the pores in the low-k dielectric layer are dilated some of which connect with one another to form one or more continuous channels extending through the thickness of the dielectric layer and allowing the HF-based solvent to reach down to the substrate. Then the passivating additive component of the HF-based etching solvent forms a passivation layer at the dielectric layer and the substrate interface that protects substrate from the HF-based etchant.

Abstract: A face cartooning system is described. In one implementation, the system generates an attractive cartoon face or graphic of a user's facial image. The system extracts facial features separately and applies pixel-based techniques customized to each facial feature. The style of cartoon face achieved resembles the likeness of the user more than cartoons generated by conventional vector-based cartooning techniques. The cartoon faces thus achieved provide an attractive facial appearance and thus have wide applicability in art, gaming, and messaging applications in which a pleasing degree of realism is desirable without exaggerated comedy or caricature.

Abstract: A chemical processing bath and system used in semiconductor manufacturing utilizes a dynamic spiking model that essentially constantly monitors chemical concentration in the processing bath and adds fresh chemical on a regular basis to maintain chemical concentrations at desirable levels. Etch rates and etch selectivities are maintained at desirable levels and contamination from undesirable precipitation is avoided. The system and method automatically compare concentration levels to a plurality of control limits associated with various technologies and identify the technology or technologies that may undergo processing.