Patents by Inventor Lin-Lin TIAN

Lin-Lin TIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20220384760
    Abstract: An organic light emitting diode display includes an integrated circuit, a first electrode, a spacer, an organic material stack layer, and a second electrode. The first electrode is electrically connected to the integrated circuit and has a top surface, a bottom surface, and an inclined surface connecting the top and bottom surfaces. An angle between the inclined surface and the bottom surface is in a range from about 45 degrees to about 80 degrees. The spacer is disposed to cover the inclined surface of the first electrode. The organic material stack layer is disposed on the first electrode. The second electrode is disposed on the organic material stack layer and the spacers.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Shui-Liang CHEN, Lin-Chun GUI, Jian HUANG, Lin-Lin TIAN
  • DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20210091329
    Abstract: An organic light emitting diode display includes an integrated circuit, a first electrode, a spacer, an organic material stack layer, and a second electrode. The first electrode is electrically connected to the integrated circuit and has a top surface, a bottom surface, and an inclined surface connecting the top and bottom surfaces. An angle between the inclined surface and the bottom surface is in a range from about 45 degrees to about 80 degrees. The spacer is disposed to cover the inclined surface of the first electrode. The organic material stack layer is disposed on the first electrode. The second electrode is disposed on the organic material stack layer and the spacers.
    Type: Application
    Filed: July 23, 2020
    Publication date: March 25, 2021
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., TSMC CHINA COMPANY LIMITED
    Inventors: Shui-Liang CHEN, Lin-Chun GUI, Jian HUANG, Lin-Lin TIAN