Abstract: An integrated vessel with wave compensation capability for transportation of completed offshore wind turbines includes a wind turbine conveyor system, a dynamic positioning propeller system, and a six-degree-of-freedom parallel manipulator system, as well as a foundation monopile of a fixed wind turbine arranged in the hull; the completed offshore wind turbines are fixed on the wind turbine conveyor system by multiple wind turbine stabilizing blocks, and a clamping system is equipped in the six-degree-of-freedom parallel manipulator system.

Abstract: A semiconductor package comprising a lead frame, a vertically stacked field-effect transistor (FET) set, a source clip, a gate clip, and a molding encapsulation. The vertically stacked FET set comprises a first FET, and a second FET. The first FET is flipped. A method comprising the steps of providing a lead frame; attaching a vertically stacked FET set, attaching clip(s), forming a molding encapsulation; and applying a singulation process.

Abstract: A chip scale semiconductor package comprises a silicon layer, a back side metal layer, and a plurality of front side pads. Each of the plurality of front side pads comprises a respective copper member and a respective solder member. A method comprises the steps of: providing a wafer; grinding the back side of the wafer forming a peripheral ring; applying a metallization process to a grinded surface; removing the peripheral ring; forming a front side seed layer; forming a front side photoresist layer; applying a photolithography process; applying a front side copper plating process; applying a front side solder plating process; stripping the front side photoresist layer; etching the front side seed layer; and applying a singulation process.

Abstract: A transcription, such as text of audio occurring at to a remote desktop and which may include a translation, may be presented concurrently with an image of the remote desktop on an unused area of a display screen. The transcription may be presented with a selectable and adjustable transparency, and can continue to be presented after the image of the remote desktop is minimized.

Abstract: Systems and methods can allow for secure cross-device sharing of transient data using direct transient data sharing (“DTDS”). A source destination can share data using local DTDS with an agent on a first device. The agent can send the data to a hub server that runs a security control process and data formatting process. The hub server can determine risk scores for the source and destination devices and allow the sharing to occur if a safety threshold is met. Then an agent on the destination device can receive the transient data and use local DTDS to send the data to a destination application.

Abstract: Example methods and systems for sensitive information protection during screen sharing on a remote desktop are described. In one example, a computer system may establish a connection between a remote desktop and a client device to allow access to multiple applications supported by the remote desktop. The computer system may obtain configuration information identifying sensitive information that includes at least a particular application from the multiple applications or an information item. Based on the configuration information, the computer system may monitor the particular application or the information item. In response to detecting that (a) screen sharing is enabled for a first user to share a visual representation associated with the remote desktop with a second user and (b) the particular application or the information item being monitored is active, the computer system may perform a remediation action to protect against potential disclosure of the sensitive information.

Abstract: A method of auditing user actions performed in remote desktop (RD) sessions, includes the steps of: acquiring a first video file that visually captures a plurality of first user actions that were performed in a first RD session by a remote device hosting the first RD session in response to instructions from a client device of the first RD session; generating a first text file describing the first user actions from the first video file, by using a generative artificial intelligence (AI) model that has been trained to generate text descriptions of user actions from video data capturing user actions in RD sessions; searching the first text file for keywords or phrases that have been identified as being associated with prohibited or suspicious actions; and in response to detecting one of the keywords or phrases in the first text file, terminating the first RD session.

Abstract: A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a seed layer, a metal support, and a molding encapsulation. A thickness of the semiconductor substrate is in a range from 15 microns to 35 microns. A thickness of the metal support is at least 30 microns. A method comprises the steps of providing a device wafer; attaching a carrier; applying a thinning process; forming a seed layer; forming a plurality of metal supports; forming a molding encapsulation; and applying a singulation process. The molding encapsulation directly contacts a plurality of side surfaces and a back surface of the metal support to facilitate efficient saw blade cutting.

Abstract: The disclosure provides for transitioning application windows between local and remote desktops. Example implementations include opening a first file with a first application to generate a first application window on a first desktop window on a user display; based at least on a trigger event for transitioning the first application window from the first desktop window to a second desktop window, determining whether a second application is available for the second desktop window to produce a version of the first application window; and based at least on the second application being available: transferring the first file across a network to become a second file; and opening the second file with the second application to generate a second application window on the second desktop window, the second application window replacing the first application window on the user display. The transition may go either direction.

Abstract: A remote desktop can be displayed with controllable transparency over a local desktop. The transparency may be varied using hotkeys. Hotkeys may also be used to control/switch the direction of user input, such as mouse and keyboard events, so as to direct the user input to the remote desktop or to the local desktop.

Abstract: Techniques are described for redirecting GPU capability from a client device to the virtual desktop. The virtual desktop client includes a GPU controller deployed on the client computing device, which is capable of virtualizing the local GPU of the client device and exposing it to the virtual desktop. The virtual desktop agent operating on the host server includes a GPU consumer, which is capable of accepting machine learning (ML) or artificial intelligence (AI) workloads on the virtual desktop and offload these workloads to the GPU controller on the client computing device. When the GPU consumer detects the ML workload task on the virtual desktop, it transmits the ML workload task over the network to the GPU controller on the client computing device, which processes the ML workload task using the GPU of the client computing device and sends the results of the processing to the GPU consumer.

Abstract: The present disclosure discloses a use of dehydroepiandrosterone (DHEA) in preparation of a drug for preventing and treating ophthalmic myopia. The drug is preferably for external use. The dosage form of the drug is an eye drop, an eye ointment, or a gel. The present disclosure also discloses the component of the DHEA drug in dosage form of eye drop, eye ointment, or gel, and a respective preparation method thereof. Experimental results have shown that the pharmaceutical formulations of the present disclosure can be effectively used for prevention and control of myopia, and is economical, safe, and effective.

Abstract: A semiconductor device comprises a semiconductor substrate, a plurality of metal layers, an adhesive layer, a compound layer, and a plurality of contact pads. A thickness of the semiconductor substrate is in a range from 15 ?m to 35 ?m. A thickness of the compound layer is larger than the thickness of the semiconductor substrate. A coefficient of thermal expansion of the compound layer is less than or equal to 9 ppm/° C. A glass transition temperature of the compound layer is larger than 150° C. The plurality of metal layers comprises a first titanium layer, a first nickel layer, a silver layer, a second nickel layer, and a metallic layer. In a first example, the metallic layer is a second titanium layer. In a second example, the metallic layer is a Titanium Nitride (TiN) layer.

Abstract: Systems and methods are provided for dynamically optimizing and configuring various aspects of virtual desktops in virtual desktop infrastructure. Data collectors can be installed on and operate on various components in the virtual desktop infrastructure, such as on the virtual desktops running on the server, on the virtual desktop clients running on user devices, and on the connection server. The data collectors can operate to collect various types of information from corresponding components, such as application usage data and status, device performance, networking environment and speed, application or system crash data, and so on. The collected data can be logged, tracked, and analyzed to perform various actions on the virtual desktop.

Abstract: A remote application installed on a first remote desktop can be shared with a second remote desktop. The first remote desktop can be associated with a first user, and the second remote desktop can be associated with the first user and/or some other user(s) different from the first user. The sharing of the remote application can be terminated from the first remote desktop and/or from the second remote desktop.

Abstract: An integrated vessel with wave compensation capability for transportation of completed offshore wind turbines includes a wind turbine conveyor system, a dynamic positioning propeller system, and a six-degree-of-freedom parallel manipulator system, as well as a foundation monopile of a fixed wind turbine arranged in the hull; the completed offshore wind turbines are fixed on the wind turbine conveyor system by multiple wind turbine stabilizing blocks, and a clamping system is equipped in the six-degree-of-freedom parallel manipulator system.

Abstract: A semiconductor device comprises a semiconductor substrate, a plurality of metal layers, an adhesive layer, a compound layer, and a plurality of contact pads. A thickness of the semiconductor substrate is in a range from 15 ?m to 35 ?m. A thickness of the compound layer is larger than the thickness of the semiconductor substrate. A coefficient of thermal expansion of the compound layer is less than or equal to 9 ppm/° C. A glass transition temperature of the compound layer is larger than 150° C. The plurality of metal layers comprises a first titanium layer, a first nickel layer, a silver layer, a second nickel layer, and a metallic layer. In a first example, the metallic layer is a second titanium layer. In a second example, the metallic layer is a Titanium Nitride (TiN) layer.

Abstract: A chip scale semiconductor package comprises a silicon layer, a back side metal layer, and a plurality of front side pads. Each of the plurality of front side pads comprises a respective copper member and a respective solder member. A method comprises the steps of: providing a wafer; grinding the back side of the wafer forming a peripheral ring; applying a metallization process to a grinded surface; removing the peripheral ring; forming a front side seed layer; forming a front side photoresist layer; applying a photolithography process; applying a front side copper plating process; applying a front side solder plating process; stripping the front side photoresist layer; etching the front side seed layer; and applying a singulation process.

Abstract: A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a plurality of metal bumps, a metal layer, and a molding encapsulation. A thickness of the semiconductor substrate is less than 35 microns. A first method comprises the steps of providing a device wafer; attaching a first carrier; applying a thinning process; forming a metal layer; applying a first tape; removing the first carrier; applying a first singulation process; removing the first tape; attaching a second carrier; forming a molding encapsulation; removing the second carrier; forming a plurality of metal bumps; applying a second tape; and applying a singulation process and removing the second tape. A second method comprises the steps of providing a device wafer; attaching a carrier; applying a thinning process; forming a metal layer; forming a molding encapsulation; removing the carrier; forming a plurality of metal bumps; and applying a singulation process.

Abstract: A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a seed layer, a first thick metal layer, a second thick metal layer, and a coating metal layer. Direct attachment of the first thick metal layer and the second thick metal layer comprises bonded metal atoms. The first thick metal layer and the second thick metal layer are bonded by an SAB process. A method comprises the steps of providing an upper device portion, providing a lower carrier portion, applying an SAB process, applying a de-bonding process, applying a tape, applying a singulation process, and removing the tape.