Patents by Inventor Lin Ming-Yang

Lin Ming-Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated heat dissipating enclosure for electronic product
    Patent number: 6979772
    Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: December 27, 2005
    Assignee: Chaun-Choung Technology Corp.
    Inventors: Huang Meng-Cheng, Lin Ming-Yang
  • Integrated heat dissipating enclosure for electronic product
    Publication number: 20050126806
    Abstract: An integrated heat dissipating enclosure to provide heat dissipation for computer, power supply or other electronic products such as an integrated circuit on a motherboard, a central processing unit, or a chip on a video adapter. The enclosure has a frame and a cooling cover. The frame is used to carry various internal components or peripherals of a computer. The cooling cover has a plurality of fins spaced from each other by a space. The fins are connected together by a thermal conductive pipe to form an integrated heat dissipating enclosure.
    Type: Application
    Filed: May 14, 2003
    Publication date: June 16, 2005
    Inventors: Huang Meng-Cheng, Lin Ming-Yang