Patents by Inventor Lin Ping Goh

Lin Ping Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contact elements
    Patent number: 6655969
    Abstract: A circuit board assembly having a circuit board including a via, and a contact element positioned adjacent to the via for providing electrical attachment of the pin to the via of the circuit board.
    Type: Grant
    Filed: February 25, 2003
    Date of Patent: December 2, 2003
    Assignee: Intel Corporation
    Inventors: Kok Wah Low, Hwan Ming Wang, Lin Ping Goh
  • Contact elements
    Publication number: 20030143877
    Abstract: A circuit board assembly having a circuit board including a via, and a contact element positioned adjacent to the via for providing electrical attachment of the pin to the via of the circuit board.
    Type: Application
    Filed: February 25, 2003
    Publication date: July 31, 2003
    Applicant: Intel Corporation.
    Inventors: Kok Wah Low, Hwan Ming Wang, Lin Ping Goh
  • Contact elements for surface mounting of burn-in socket
    Patent number: 6572389
    Abstract: A circuit board assembly having a circuit board with at least one via, a pin for insertion into the via, and a contact element positioned adjacent to the pin and the via for providing electrical attachment of the pin to the via of the circuit board. The pin is detachable from the via and the contact element deforms upon insertion of the pin.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: June 3, 2003
    Assignee: Intel Corporation
    Inventors: Kok Wah Low, Hwan Ming Wang, Lin Ping Goh
  • Contact elements for surface mounting of burn-in socket
    Publication number: 20020076957
    Abstract: A circuit board assembly having a circuit board with at least one via, a pin for insertion into the via, and a contact element positioned adjacent to the pin and the via for providing electrical attachment of the pin to the via of the circuit board. The pin is detachable from the via and the contact element deforms upon insertion of the pin.
    Type: Application
    Filed: December 14, 2000
    Publication date: June 20, 2002
    Applicant: Intel Corporation
    Inventors: Kok Wah Low, Hwan Ming Wang, Lin Ping Goh