Patents by Inventor Lin Ting

Lin Ting has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Patent number: 11977318
    Abstract: A portable electronic device and a movable lens-shutting module thereof are provided. The lens-shutting module includes a first magnetic assembly, a second magnetic assembly and a movable shielding assembly. The first magnetic assembly includes a fixed magnetic field generator and a movable magnetic structure including a matching portion. The second magnetic assembly includes a fixed magnetic structure, a flexible structure and a movable magnetic field generator including a limiting portion. The movable shielding assembly includes a lens shielding portion corresponding to a lens module, a matching opening matching with the matching portion, and a limiting opening corresponding to the limiting portion.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: May 7, 2024
    Assignee: AZUREWAVE TECHNOLOGIES, INC.
    Inventors: Kung-An Lin, Chien-Che Ting
  • Publication number: 20240147664
    Abstract: A flow guiding device in an immersion-cooled chassis of a server comprises at least one deflector located above a chip on a mainboard in the chassis, each deflector comprises a first end for mounting to the mainboard above the chip and a second end inclined away from the mainboard. The first end is immersed in coolant, the second end is higher than the first end; the deflector further comprises a hollow part including multiple through holes for interrupting upward movement vapor bubbles generated by the hot chip, which reduces probability of the vapor bubbles escaping from the coolant liquid and the chassis. A liquid-cooled chassis having the flow guiding device is also disclosed.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 2, 2024
    Inventors: SUNG TSANG, TSUNG-LIN LIU, YU-CHIA TING, CHENG-YI HUANG, CHIA-NAN PAI
  • Publication number: 20240147660
    Abstract: A manifold for cooling server includes an inlet pipe, an outlet pipe, a plurality of first hole groups, and a plurality of second hole groups. The distance between every two adjacent first hole groups is first distance, the distance between every two adjacent second hole groups is second distance, and the first distance is not equal to the second distance. The first distance is designed for one size of server, and the second distance is designed for another size of server. When changing the size of all servers in the rack, turning manifold 100 to 180 degrees to change the first hole groups 30 to the second hole groups 40 for adapting the severs, which makes the manifold 100 adapt two different sizes of server. A rack and a data center cooling system using the manifold are also disclosed.
    Type: Application
    Filed: June 12, 2023
    Publication date: May 2, 2024
    Inventors: YU-CHIA TING, TSUNG-LIN LIU
  • Publication number: 20240133949
    Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yu-Lin Yang, Chin-Wei Lin, Po-Chao Tsao, Tung-Hsing Lee, Chia-Jung Ni, Chi-Ming Lee, Yi-Ju Ting
  • Publication number: 20230282513
    Abstract: A recovery layer (e.g., a layer of organic and/or tin-based material) is formed within recesses, in which adjacent MEOL or BEOL structures are formed, after plasma ashing and before a trimming process. The recovery layer preserves hardmask material and dielectric material such that upper surfaces of the adjacent MEOL or BEOL structures remain physically separated. As a result, the adjacent MEOL or BEOL remain electrically isolated and functional.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 7, 2023
    Inventors: Zheng-En BAO, Po-Ju CHEN, Chih-Teng LIAO, Jiann-Horng LIN, Lin-Ting LIN
  • Patent number: 11545619
    Abstract: A method for forming a memory device structure is provided. The method includes providing a substrate, a first dielectric layer, a conductive via, a magnetic tunnel junction cell, a first etch stop layer, and a first spacer layer. The substrate has a first region and a second region, the first dielectric layer is over the substrate, the conductive via passes through the first dielectric layer over the first region. The method includes removing the first etch stop layer, which is not covered by the first spacer layer. The method includes removing the first dielectric layer, which is not covered by the first etch stop layer.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: January 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsing-Hsiang Wang, Han-Ting Lin, Yu-Feng Yin, Sin-Yi Yang, Chen-Jung Wang, Yin-Hao Wu, Kun-Yi Li, Meng-Chieh Wen, Lin-Ting Lin, Jiann-Horng Lin, An-Shen Chang, Huan-Just Lin
  • Publication number: 20220271087
    Abstract: A semiconductor structure and a method for forming a semiconductor structure are provided. A substrate having a cell region and a mark region is received. A dielectric layer is etched to expose a conductive line in the cell region and form a trench in the mark region. A conductive layer is formed over the cell region and in the trench. The conductive layer is etched to form a bottom electrode via in the cell region and a first mark layer in the trench.
    Type: Application
    Filed: February 24, 2021
    Publication date: August 25, 2022
    Inventors: HAN-TING LIN, JIANN-HORNG LIN, HSING-HSIANG WANG, HUAN-JUST LIN, SIN-YI YANG, CHEN-JUNG WANG, KUN-YI LI, MENG-CHIEH WEN, LAN-HSIN CHIANG, LIN-TING LIN
  • Publication number: 20220029091
    Abstract: A method for forming a memory device structure is provided. The method includes providing a substrate, a first dielectric layer, a conductive via, a magnetic tunnel junction cell, a first etch stop layer, and a first spacer layer. The substrate has a first region and a second region, the first dielectric layer is over the substrate, the conductive via passes through the first dielectric layer over the first region. The method includes removing the first etch stop layer, which is not covered by the first spacer layer. The method includes removing the first dielectric layer, which is not covered by the first etch stop layer.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 27, 2022
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsing-Hsiang WANG, Han-Ting LIN, Yu-Feng YIN, Sin-Yi YANG, Chen-Jung WANG, Yin-Hao WU, Kun-Yi LI, Meng-Chieh WEN, Lin-Ting LIN, Jiann-Horng LIN, An-Shen CHANG, Huan-Just LIN
  • Patent number: 7091735
    Abstract: A testing probe includes a first sleeve, a first springy component, a first movable rod, a second springy component, and at least one second movable rod. The first sleeve has a first containing portion, which is located inside the first containing portion. The first movable rod is partially inserted into the first containing portion, and has a first stopper portion and a second containing portion. The first stopper portion is located inside the first containing portion and contacts the first springy component, so that the first movable rod and first containing portion are capable of relatively sliding. The second springy component is located inside the second containing portion. The second movable rod is partially inserted into the second containing portion, and has a second stopper portion. The second stopper portion is located inside the second containing portion and contacts the second springy component, so that the second movable rod and second containing portion are capable of relatively sliding.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: August 15, 2006
    Assignee: Asustek Computer Inc.
    Inventors: Chung-Shan Lee, Hsu-Lin Ting
  • Publication number: 20050252348
    Abstract: A hand tool includes a body having a function end such as a socket connection end of a screw driver end at a first end of the body and a first assistant bar movably extends through a through hole defined transversely through the body. The first assistant bar performs an arm of force when rotating the body and can be adjusted the length relative to the body. A second assistant bar is rotatably connected to a second end of the body so as to press the object to be tightened or loosened at the function end of the body.
    Type: Application
    Filed: May 17, 2004
    Publication date: November 17, 2005
    Inventor: Lin Ting
  • Publication number: 20050151556
    Abstract: A testing probe includes a first sleeve, a first springy component, a first movable rod, a second springy component, and at least one second movable rod. The first sleeve has a first containing portion, which is located inside the first containing portion. The first movable rod is partially inserted into the first containing portion, and has a first stopper portion and a second containing portion. The first stopper portion is located inside the first containing portion and contacts the first springy component, so that the first movable rod and first containing portion are capable of relatively sliding. The second springy component is located inside the second containing portion. The second movable rod is partially inserted into the second containing portion, and has a second stopper portion. The second stopper portion is located inside the second containing portion and contacts the second springy component, so that the second movable rod and second containing portion are capable of relatively sliding.
    Type: Application
    Filed: September 30, 2004
    Publication date: July 14, 2005
    Inventors: Chung-Shan Lee, Hsu-Lin Ting
  • Publication number: 20050061694
    Abstract: A tool box includes a base and a cover which is pivotably connected to the base. Each of the base and the cover has a periphery and a matching edge located at a distance from the periphery. The two respective matching edges are in contact with each other when the cover is mounted on the base, and a gap is defined between the periphery of the cover and the periphery of the base. The matching edges and the base and the cover are made to be different colored.
    Type: Application
    Filed: May 17, 2004
    Publication date: March 24, 2005
    Inventor: Lin Ting