Patents by Inventor Lin Tsui Yee

Lin Tsui Yee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and method of manufacturing the integrated circuit package
    Patent number: 6940154
    Abstract: The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: September 6, 2005
    Assignee: ASAT Limited
    Inventors: Serafin Pedron, Neil Robert McLellan, Lin Tsui Yee
  • Integrated circuit package and method of manufacturing the integrated circuit package
    Publication number: 20030234454
    Abstract: The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed.
    Type: Application
    Filed: June 24, 2002
    Publication date: December 25, 2003
    Inventors: Serafin Pedron, Neil Robert McLellan, Lin Tsui Yee
  • Method of manufacturing an encapsulated integrated circuit package
    Publication number: 20030143776
    Abstract: The present invention relates to a method of manufacturing an integrated circuit package, including providing a lead frame without a die attachment pad, the lead frame having a ridge portion protruding from a base portion, the ridge portion having an upper surface and defining an upper portion of a cavity, the base portion having a lead and a lower surface, attaching an adhesive strip to at least the lower surface of the base portion to seal a bottom portion of the cavity, encapsulating the cavity such that at least a portion of the upper surface of the ridge portion of the lead frame and at least a portion of the lower surface of the base portion are exposed, and removing the adhesive strip.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventors: Serafin Pedron, Neil Robert McLellan, Chun Ho Fan, Luk Chung Ho Jerro, Lin Tsui Yee