Patents by Inventor Lin Wang Yu

Lin Wang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package-on-package device, semiconductor package and method for manufacturing the same
    Patent number: 7838334
    Abstract: A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an embedded component and a plurality of electric contacts, wherein the embedded component is located between the upper and lower surfaces of the interposer, and the electric contacts are located on the upper surface of the interposer. The molding compound seals the chip and covers the upper surface of the substrate and the lower surface of the interposer.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: November 23, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Lin Wang Yu, Cheng Yi Weng
  • PACKAGE-ON-PACKAGE DEVICE, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20100133675
    Abstract: A semiconductor package includes a substrate, a chip, an interposer and a molding compound. The chip is electrically connected to the upper surface of the substrate. The interposer is disposed on the chip, and electrically connected to the upper surface of the substrate. The interposer includes an embedded component and a plurality of electric contacts, wherein the embedded component is located between the upper and lower surfaces of the interposer, and the electric contacts are located on the upper surface of the interposer. The molding compound seals the chip and covers the upper surface of the substrate and the lower surface of the interposer.
    Type: Application
    Filed: September 23, 2009
    Publication date: June 3, 2010
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Lin Wang Yu, Cheng Yi Weng