Patents by Inventor Lin Wei ZHENG

Lin Wei ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for pull testing of wire bonds
    Patent number: 9889521
    Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: February 13, 2018
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yi Bin Wang, Qing Le Tan, Lin Wei Zheng, Jia Le Luo
  • METHOD AND SYSTEM FOR PULL TESTING OF WIRE BONDS
    Publication number: 20160153880
    Abstract: A method for pull testing a wire bond. The method including the steps of: (i) with a wire bonding tool, bonding an end of a wire to make a bond at a first location on a bonding surface having a conductive material, such that the bond completes an electrical circuit; (ii) clamping the wire with a wire clamp; (iii) pulling the wire with the wire clamp to apply a predetermined pulling force; (iv) detecting whether the electrical circuit is open; and (v) if the electrical circuit is open, determining that there has been a bond failure, and automatically incrementing a bond failure count.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 2, 2016
    Inventors: Keng Yew SONG, Yi Bin WANG, Qing Le TAN, Lin Wei ZHENG, Jia Le LUO