Abstract: A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads; the first circuit board comprises a first surface, an opposite second surface, a plurality of exposed electro-connecting ends, a plurality of first conductive pads on the first surface, a plurality of conductive vias, and at least one circuit layer, therewith the electrode pads of the first chip electrically connecting to the electro-connecting ends and the first conductive pads directly through the conductive vias and the circuit layer; and a second package structure electrically connecting to the first package structure through a plurality of first solder balls to make a package on package. The stacked package module of this invention has characters of compact size, high performance, high flexibility, and detachability.

Abstract: A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility.

Abstract: The present invention provides a chip carrier structure having a semiconductor chip embedded therein and a protective metal layer formed thereon and a fabrication method thereof. The chip carrier structure includes a chip-embedded carrier structure, and a metal layer formed by electroplating on the bottom surface and side surfaces of the chip-embedded carrier structure. The metal layer prevents moisture from crossing the side surfaces of the chip-embedded carrier structure, so as to prevent delamination, provide a shielding effect, and improve heat dissipation through the metal layer.

Abstract: A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the conductive film corresponding to the bonding pads. The exposed portions of the conductive film is removed to expose the bonding pads respectively via the first openings. The exposed bonding pads are plated with a metal layer respectively. Then, the photoresist layer and the remainder of the conductive film covered by the photoresist layer are removed. A solder mask having a plurality of second openings may be formed on the surface of the substrate, and allows the plated metal layer on the bonding pads respectively to be exposed via the second openings.

Abstract: A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

Abstract: An apparatus for driving microfluids is provided. The apparatus comprises a driving unit and a microfluidic chip. The driving unit comprises a substrate and a film, wherein the film is combined with the substrate. Moreover, the microfluidic chip is coupled with the driving unit.

Abstract: Pyrimidine derivatives of formula (I) in which J and Y represent aromatic or heteroaromatic rings; R2, G, G?, and G? represent substituent groups and R2a represents H or halogen; L represents a linking group; and M represents CH or N. Pharmaceutical compositions containing these compounds, and methods of using these compounds in treatment of hyperproliferative diseases such as cancer are also disclosed and claimed.

Abstract: A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting layer are formed on a surface of the first and second carrier boards respectively. At least one first semiconductor component and at least one second semiconductor component are disposed on the first and second protecting layers and accommodated in the first and second through holes respectively. A dielectric layer is laminated between the surfaces of the first and second carrier boards without the protecting layers formed thereon. Thus, a modularized package structure with reduced space waste is formed.

Abstract: A method of coding an audio signal comprises receiving an audio signal x to be coded and transforming the received signal from the time to the frequency domain. A quantised audio signal {tilde over (x)} is generated from the transformed audio signal x together with a set of long-term prediction coefficients A which can be used to predict a current time frame of the received audio signal directly from one or more previous time frames of the quantised audio signal {tilde over (x)}. A predicted audio signal {circumflex over (x)} is generated using the prediction coefficients A. The predicted audio signal {circumflex over (x)} is then transformed from the time to the frequency domain and the resulting frequency domain signal compared with that of the received audio signal x to generate an error signal E(k) for each of a plurality of frequency sub-bands.

Abstract: A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

Abstract: A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

Abstract: A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.

Abstract: A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit layer. Then, a patterned resistive material is formed on the inner circuit board and electrically connected to the resistor electrodes to accurately define a resistance value of resistors. Subsequently, at least one insulating layer is coated on a surface of the circuit board having the patterned resistive material. At least one patterned second circuit layer is formed on the insulating layer and electrically connected to the resistor electrodes by a plurality of conductive vias formed in the insulating layer or plated through holes formed through the circuit board.

Abstract: The invention uses digital signal processing (DSP) techniques to synchronize an audio encoding process with a video synchronization signal. Namely, the encoder parameters of a DSP microchip are preset according to characteristics of an audio frame. A buffer temporarily stores the audio frame prior to sending it to an encoder. The buffer then transfers the frame in response to receiving a video synchronization signal in conjunction with authorization from a microprocessor. As such, the encoding sequence of the audio frame coincides with the video synchronization signal. Since the corresponding video frame is already slaved to the video synchronization signal, the audio samples are effectively processed in sequence with the video data. Prior to outputting the encoded audio frame to a multiplexor, the encoder sends a value to the microprocessor representing the difference between the end of the encoded audio frame and a second video synchronization signal.

Abstract: A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the conductive film corresponding to the bonding pads. The exposed portions of the conductive film is removed to expose the bonding pads respectively via the first openings. The exposed bonding pads are plated with a metal layer respectively. Then, the photoresist layer and the remainder of the conductive film covered by the photoresist layer are removed. A solder mask having a plurality of second openings may be formed on the surface of the substrate, and allows the plated metal layer on the bonding pads respectively to be exposed via the second openings.

Abstract: A heat sink structure with embedded electronic components is proposed, wherein a plurality of recessed cavities are formed on a heat sink for embedding the electronic components and receiving at least one semiconductor chip therein. This arrangement enhances electric performance of a semiconductor package with the above heat sink structure and improves heat dissipating efficiency of the semiconductor package.

Abstract: A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the conductive film corresponding to the bonding pads. The exposed portions of the conductive film is removed to expose the bonding pads respectively via the first openings. The exposed bonding pads are plated with a metal layer respectively. Then, the photoresist layer and the remainder of the conductive film covered by the photoresist layer are removed. A solder mask having a plurality of second openings may be formed on the surface of the substrate, and allows the plated metal layer on the bonding pads respectively to be exposed via the second openings.

Abstract: A method of coding an audio signal comprises receiving an audio signal x to be coded and transforming the received signal from the time to the frequency domain. A quantised audio signal {tilde over (x)} is generated from the transformed audio signal x together with a set of long-term prediction coefficients A which can be used to predict a current time frame of the received audio signal directly from one or more previous time frames of the quantised audio signal {tilde over (x)}. A predicted audio signal {circumflex over (x)} is generated using the prediction coefficients A. The predicted audio signal {circumflex over (x)} is then transformed from the time to the frequency domain and the resulting frequency domain signal compared with that of the received audio signal x to generate an error signal E(k) for each of a plurality of frequency sub-bands.

Abstract: A method of coding an audio signal comprises receiving an audio signal x to be coded and transforming the received signal from the time to the frequency domain. A quantised audio signal {tilde over (x)} is generated from the transformed audio signal x together with a set of long-term prediction coefficients A which can be used to predict a current time frame of the received audio signal directly from one or more previous time frames of the quantised audio signal {tilde over (x)}. A predicted audio signal {circumflex over (x)} is generated using the prediction coefficients A. The predicted audio signal {circumflex over (x)} is then transformed from the time to the frequency domain and the resulting frequency domain signal compared with that of the received audio signal x to generate an error signal E(k) for each of a plurality of frequency sub-bands.

Abstract: Provided is a system and method for a modem including one or more processing paths. Also included is a number of interconnected modules sequentially arrayed along the one or more paths. Each module is configured to (i) process signals passed along the paths in accordance with the sequence and (ii) implement predetermined functions to perform the processing. Further, each of the modules has a particular degree of functional programmability and the degrees of functional programmability monotonically vary in accordance with the sequence.