Patents by Inventor Lin

Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10778021
    Abstract: Aspects of the present disclosure provide a charging case for headphones. The charging case for headphones includes cable management features that allow headphones to be recharged while securely held in the charging case. The headphone charging case may switch between a docked mode and a charging mode. In the docked mode, cable management features help secure the charging cable and charging cable connector in place. In the charging mode, the charging cable is extended so that the charging cable connector attaches to the headphones while the headphones are positioned in the charging case.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 15, 2020
    Assignee: BOSE CORPORATION
    Inventors: Elizabeth Victoria Alexander, Yi Chang Lin, Ya Hsuan Sun
  • Patent number: 10773218
    Abstract: Described herein is a graphene material such as graphene oxide and polymer based selectively permeable element that provides selective permeability between polar and non-polar molecules such as fluid, gas or vapor. The methods for making these selectively permeable elements and related devices are also described.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: September 15, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shijun Zheng, Peng Wang, Rebecca Romero, Isamu Kitahara, Weiping Lin
  • Patent number: 10778531
    Abstract: A hosting system is provided. The hosting system includes a grid of hardware nodes for provisioning virtual servers including a first virtual server for a first user and a second virtual server for a second user. The hosting system further includes dedicated servers including a first dedicated server for the first user and a second dedicated server for the second user. A switch, in response to the first virtual server and the second virtual server having overlapping virtual local area network (VLAN) identifications (IDs), defines a first broadcast domain for the first user and a second broadcast domain for the second user, places the first virtual server and the first dedicated server in the first broadcast domain, and places the second virtual server and the second dedicated server in the second broadcast domain.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 15, 2020
    Assignee: OPEN INVENTION NETWORK LLC
    Inventors: Yogesh Angrish, Yueqin Lin, Martin A. Berryman, Justin M. Kitagawa, Paul Lappas
  • Patent number: 10778791
    Abstract: A current user activity of a first user interacting with a first social system can be monitored. A cognitive insight into at least one user activity of at least a second user relating to the current user activity of the first user can be generated. The cognitive insight can include a listing of user activity data, each representing a respective user activity of at least the second user relating to the current user activity of the first user. The cognitive insight can indicate, for each user activity data contained in the listing, a respective duration of time for which the user activity data is to be presented to the first user. The cognitive insight can be communicated to the first social system, which can present to the first user each user activity data in the listing for the respective duration of time indicated in the cognitive insight.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: September 15, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul R. Bastide, Lin Sun, Liam S. Harpur, Matthew E. Broomhall
  • Patent number: 10777692
    Abstract: A photo-detecting apparatus includes a semiconductor substrate. A first germanium-based light absorption material is supported by the semiconductor substrate and configured to absorb a first optical signal having a first wavelength greater than 800 nm. A first metal line is electrically coupled to a first region of the first germanium-based light absorption material. A second metal line is electrically coupled to a second region of the first germanium-based light absorption material. The first region is un-doped or doped with a first type of dopants. The second region is doped with a second type of dopants. The first metal line is configured to control an amount of a first type of photo-generated carriers generated inside the first germanium-based light absorption material to be collected by the second region.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: September 15, 2020
    Assignee: Artilux, Inc.
    Inventors: Szu-Lin Cheng, Chien-Yu Chen, Shu-Lu Chen, Yun-Chung Na, Ming-Jay Yang, Han-Din Liu, Che-Fu Liang
  • Patent number: 10775672
    Abstract: A display device includes a first substrate, first signal lines, second signal lines, active elements, pixel electrodes, a second substrate, a black matrix, a first spacer, and a second spacer. The active elements are electrically connected with the first signal lines and the second signal lines. The black matrix includes first portions and second portions. The first portions overlap the first signal lines. The second portions overlap the second signal lines. The first spacer overlaps a source and a drain of one of the active elements. The second spacer overlaps a source and a drain of another one of the active elements. The shortest distance between the center of the first spacer and the center line of the closest one of the first portions is different from the shortest distance between the center of the second spacer and the center line of the closest one of the first portions.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: September 15, 2020
    Assignee: Au Optronics Corporation
    Inventors: Wei-Ren Chen, Lin-Chieh Wei
  • Patent number: 10777516
    Abstract: The present disclosure provides a fan-out antenna packaging structure for a semiconductor chip and its fabricating method. The structure is a stacked-up two sets of metal connecting columns and antenna metal patterns arranged in two sequential layers of packaging materials. In some applications there can be more than two sets of the stacked-up antenna structures, fabricated around the chip at one side of a rewiring layer. The chip is interconnected to external metal bumps on the other side of the rewiring layer.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: September 15, 2020
    Assignee: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION
    Inventors: Yenheng Chen, Chengchung Lin, Chengtar Wu
  • Patent number: 10777510
    Abstract: A semiconductor device and a method of manufacture thereof are provided. The method for manufacturing the semiconductor device includes forming a first dielectric layer on a substrate. Next, forming a first dummy metal layer on the first dielectric layer. Then, forming a second dielectric layer over the first dummy metal layer. Furthermore, forming an opening in the second dielectric layer and the first dummy metal layer. Then, forming a dummy via in the opening, wherein the dummy via extending through the second dielectric layer and at least partially through the first dummy metal layer. Finally, forming a second dummy metal layer on the second dielectric layer and contact the dummy via.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Kuo-Yen Liu, Hsin-Chun Chang, Tzu-Li Lee, Yu-Ching Lee, Yih-Ching Wang
  • Patent number: 10777461
    Abstract: A method of manufacturing chip package is disclosed. The method includes steps of providing a wafer with an upper surface and a lower surface opposite thereto, in which a plurality of conductive pads are disposed on the upper surface; forming a plurality of conductive bumps on the corresponding conductive pads; thinning the wafer from the lower surface towards the upper surface; forming an insulating layer under the lower surface; etching the upper surface of the wafer to form a plurality of trenches exposing the insulating layer; forming a passivation layer covering an inner wall of each of the trenches; and dicing the passivation layer and the insulating layer along each of the trenches to form a plurality of chip packages.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: September 15, 2020
    Assignee: COMCHIP TECHNOLOGY CO., LTD.
    Inventors: Chien-Chih Lai, Hung-Wen Lin
  • Patent number: 10777402
    Abstract: The invention generally relates to systems and methods for quantifying an analyte extracted from a sample. In certain embodiments, the invention provides methods that involve introducing a solvent into a capillary, introducing the capillary into a vessel including a sample such that a portion of the sample is introduced into the capillary, moving the sample and the solvent within the capillary to induce circulation within the sample and the solvent, thereby causing the analyte to be extracted from the sample and into the solvent, analyzing the analyte that has been extracted from the sample, and quantifying the analyte. In certain embodiments, the quantifying step is performed without knowledge of a volume of the sample and/or solvent.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: September 15, 2020
    Assignee: Purdue Research Foundation
    Inventors: Zheng Ouyang, Yue Ren, Ziqing Lin
  • Patent number: 10777522
    Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate, a plurality of metallic pillars, a plurality of metallic protrusions, a capping layer, and a passivation layer. The metallic pillars are disposed on the substrate. The metallic protrusions extend from an upper surface of the metallic pillars. The capping layer is disposed on the metallic protrusions. The passivation layer is disposed on sidewalls of the protrusions and the capping layer.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: September 15, 2020
    Assignee: Nanya Technology Corporation
    Inventor: Chih-Ching Lin
  • Patent number: 10775276
    Abstract: A portable gas detecting device includes at least one detecting chamber, at least one gas sensor and at least one actuator. The gas sensor is disposed in the detecting chamber and configured for monitoring gas inside the detecting chamber. The actuator is disposed in the detecting chamber and includes a piezoelectric actuator. When an actuating signal is applied to the piezoelectric actuator and the piezoelectric actuator generates a resonance effect, the gas outside the detecting chamber is introduced into the detecting chamber for sampling. The actuator is driven by an instantaneous sampling pulse to control a trace of gas to flow into the detecting chamber for forming a stable airflow environment. In the stable airflow environment, a gas molecule is dissolved in or bonded to a reaction material on a surface of the gas sensor for reacting.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: September 15, 2020
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Chiu-Lin Lee, Ching-Sung Lin, Chi-Feng Huang, Yung-Lung Han, Chun-Yi Kuo
  • Patent number: 10775354
    Abstract: An automated ambient air sampling system and method for monitoring organic compounds that may provide continuous data, the system including a thermal desorption system, an injection port, a pre-concentration system, a gas chromatograph and an ion trap mass spectrometer, wherein an air sampling chamber may also function as a thermal desorption chamber.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: September 15, 2020
    Assignee: Brigham Young University
    Inventors: Jaron Hansen, Paul Cropper, Delbert J. Eatough, Robert Cary, Lin Lin, Lee Hansen
  • Patent number: 10777433
    Abstract: A wafer bonding method includes placing a first wafer on a first bonding framework including a plurality of outlet holes around a periphery of the first bonding framework. A second wafer is placed on a second bonding framework that includes a plurality of inlet holes around a periphery of the second bonding framework. The first bonding framework is in overlapping relation to the second bonding framework such that a gap exist between the first wafer and the second wafer. A gas stream is circulated through the gap between the first wafer and the second wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the first wafer and the second wafer.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: September 15, 2020
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Wei Lin, Spyridon Skordas, Robert R. Young, Jr.
  • Patent number: 10774241
    Abstract: A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: September 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Kuo-Yin Lin, Wen-Kuei Liu, Teng-Chun Tsai, Shen-Nan Lee, Kuo-Cheng Lien, Chang-Sheng Lin, Yu-Wei Chou
  • Patent number: D896180
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: September 15, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventor: Po-Han Lin
  • Patent number: D896406
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: September 15, 2020
    Inventor: Chi-Chung Lin
  • Patent number: D896414
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: September 15, 2020
    Inventor: Chi-Chung Lin
  • Patent number: D896415
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: September 15, 2020
    Inventor: Chi-Chung Lin
  • Patent number: D896418
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: September 15, 2020
    Assignee: PUTIAN XIDENGKE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Jianhong Lin