Abstract: Provided are a thin film transistor and a manufacturing method thereof, a display panel, and a display apparatus. The thin film transistor comprises an active region (11), a gate insulating layer (12), a gate (13), a source (14) and a drain (15), a passivation layer (16), and a planarization layer (17) that are successively formed on a flexible substrate (10), wherein a protective layer (18) is formed between the passivation layer (16) and the planarization layer (17), and located directly above the active region (11) and the gate (13). The protective layer (18) is used to protect the semiconductor material of the thin film transistor in a perpendicular area of protective layer (18). Therefore, the stress on part of the materials of the thin film transistor is reduced during bending, and damage to the semiconductor material is avoided during bending of the thin film transistor device, thus improving the quality of the device.

Abstract: A substrate support apparatus includes a housing and a plurality of spherical supports. The housing has a top surface, the top surface including a plurality of openings. The housing is configured to position the plurality of spherical supports within the plurality of openings so that topmost surfaces of the plurality of spherical supports are arranged in a plane above the top surface. A spherical support of the plurality of spherical supports is rotatable within the housing.

Abstract: A display device includes a flexible layer, a display unit, a cover layer, and an adhesive member. The flexible layer includes a non-bending portion and a bending portion adjacent to the non-bending portion. The display unit is disposed on the flexible layer. The cover layer is disposed on the display unit. The adhesive member is disposed between the non-bending portion of the flexible layer and the cover layer.

Abstract: A method for closing a hole penetrating a hole height from a first surface of a metal article through a second surface of the metal article is disclosed including removing a portion of the metal article surrounding the hole from the metal article. The portion includes a depth extending from the first surface into the metal article and terminating prior to the second surface. Removing the portion forms a support surface within the hole adjacent and opposite to the second surface. A metal support structure is disposed within the hole on the support surface, and a metal composition is applied into the hole and onto the metal support structure. The metal support structure, the metal composition, and the metal article are fused together.

Abstract: A composition for preparing a foam, a foam, and a shoe employing the foam are provided. The composition for preparing a foam includes 3-30 parts by weight of a first polymer and at least one of a second polymer and a third polymer. The first polymer is cyclic olefin polymer (COP), cyclic olefin copolymer (COC), metallocene based cyclic olefin copolymer (mCOC), fully hydrogenated conjugated diene-vinyl aromatic copolymer, or a combination thereof. The total weight of the second polymer and the third polymer is 70-97 parts by weight. The second polymer is polyolefin, olefin copolymer, or a combination thereof. The third polymer is conjugated diene-vinyl aromatic copolymer, partially hydrogenated conjugated diene-vinyl aromatic copolymer, or a combination thereof. The total weight of the first polymer and at least one of the second polymer and the third polymer is 100 parts by weight.

Abstract: A method for hardfacing a metal article is disclosed including applying a first pass of a metal composition to a surface of the metal article along a first application path, applying a second pass of the metal composition to the surface along a second application path, and applying a third pass of the metal composition to the surface along a third application path between the first application path and the second application path. The first pass and the second pass form a hardfacing perimeter, and the third pass fills in the hardfacing perimeter.

Abstract: In one embodiment, a method includes: obtaining location information and motion information of a wireless communication apparatus, and a data set from one or more information sources external to the wireless communication apparatus; and organizing data of the data set for display, where the organizing is based on the location and motion information of the wireless communication apparatus. Methods of other embodiments may also include defining a search radius based on the location information and motion information of the wireless communication apparatus, and the organizing may also include filtering the data set from the one or more information sources to exclude data from information sources outside the defined search radius.

Abstract: A tire includes a tire carcass, and a tread extending circumferentially about the tire carcass and including a noise-reducing tread pattern. The noise-reducing tread pattern includes a plurality of tread elements, with the tread elements having a first pitch length (1), a second pitch length (2), or a third pitch length (3). The noise-reducing tread pattern includes one of the following circumferential configurations: a circumferential row including 40 pitches, with 13 occurrences of “1,” 13 occurrences of “2,” and 14 occurrences of “3;” a circumferential row including 38 pitches, with 10 occurrences of “1,” 19 occurrences of “2,” and 9 occurrences of “3;” a circumferential row including 42 pitches, with 10 occurrences of “1,” 19 occurrences of “2,” and 13 occurrences of “3;” and a circumferential row including 44 pitches, with 11 occurrences of “1,” 20 occurrences of “2,” and 13 occurrences of “3.

Abstract: Provided is a nitride semiconductor device including a substrate, a nucleation layer, a buffer layer, a channel layer, a first electrode, and a second electrode. The substrate has a first surface and a second surface opposite to the first surface. The nucleation layer, the buffer layer, the channel layer, and the barrier layer are sequentially disposed on the first surface of the substrate. The first electrode layer and the second electrode layer are disposed on the barrier layer. A first void penetrates through the substrate, the nucleation layer, the buffer layer, the channel layer, and the barrier layer and exposes a portion of the first electrode.

Abstract: Techniques and systems are described to determine personalized digital image aesthetics in a digital medium environment. In one example, a personalized offset is generated to adapt a generic model for digital image aesthetics. A generic model, once trained, is used to generate training aesthetics scores from a personal training data set that corresponds to an entity, e.g., a particular user, group of users, and so on. The image aesthetics system then generates residual scores (e.g., offsets) as a difference between the training aesthetics score and the personal aesthetics score for the personal training digital images. The image aesthetics system then employs machine learning to train a personalized model to predict the residual scores as a personalized offset using the residual scores and personal training digital images.

Abstract: An earphone includes a loudspeaker, a microphone, a housing supporting the loudspeaker and microphone, and an ear tip surrounding the housing and configured to acoustically couple both the loudspeaker and the microphone to an ear canal of a user, and to acoustically close the entrance to the user's ear canal. A processor receives input audio signals from the microphone, detects peaks having a frequency of around 1 Hz in the input audio signals, based on the detected peaks, computes an instantaneous heart rate, measures a frequency of an oscillation within the instantaneous heart rate, and based on the frequency of the oscillation, computes a rate of respiration.

Abstract: A method for closing a plurality of holes penetrating from a first surface of a metal article through a second surface of the metal article is disclosed including applying the metal composition to the first surface along a bridging application path. The bridging application path passes over the plurality of holes between a first edge of each of the plurality of holes and a second edge of each of the plurality of holes. Applying the metal composition along the bridging application path closes the plurality of holes.

Abstract: A method of manufacturing a semiconductor device and the semiconductor device are provided in which a plurality of layers with cobalt-zirconium-tantalum are formed over a semiconductor substrate, the plurality of layers are patterned, and multiple dielectric layers and conductive materials are deposited over the CZT material. Another layer of CZT material encapsulates the conductive material.

Abstract: A semiconductor structure includes a substrate having a memory array region and a peripheral circuit region; a plurality of first line patterns positioned in the memory array region and extending along a first direction; a plurality of second line patterns positioned over the first line patterns in the memory array region; and a plurality of linear features positioned in the peripheral circuit region. The plurality of second line patterns extend along a second direction different from the first direction. The plurality of second line patterns and the plurality of linear features are positioned at substantially the same level in the substrate.

Abstract: An image sensor module comprises: a substrate having a first side and second side, the first side being an opposite of the second side, an image sensor attached to the first side of the substrate, bonding wires to bond the image sensor to pads on the first side of the substrate, a protective structure disposed on the first side of the substrate surrounding the image sensor, the bonding wires, and the pads, the protective structure having a dam and a lid, a cover glass disposed on the protective structure, and a set of solder balls attached to the second side of the substrate.

Abstract: A storage device includes a data storage medium and a control unit. The data storage medium includes a spare block pool including a plurality of spare blocks. Each spare block includes a plurality of data pages. The control unit is electrically coupled to the data storage medium. The control unit is configured to receive data from a host and to determine whether the data is sequential data according to a default policy. The data is written into at least two of the plurality of data pages in one of the plurality of spare blocks respectively. The control unit and a data storing method for the storage device are also provided.

Abstract: A chip-stack structure including a first chip and a second chip located on the first chip is provided. The first chip includes a first substrate, a first interconnect structure, a first pad, and a first contact conductor. The first interconnect structure is located on a first surface of the first substrate. The first pad is located on the first interconnect structure. The first contact conductor is located in the first substrate and exposed on a second surface of the first substrate opposite to the first surface. The second chip includes a second substrate, a second interconnect structure, a second pad, and a second contact conductor. The second interconnect structure is located on the second substrate. The second pad is located on the second interconnect structure. The second contact conductor is located in the second substrate, wherein the first contact conductor is directly physically in contact with the second pad.

Abstract: A wireless transmit/receive unit (WTRU) may receive a unique word-error check (UW-EC) encoded signal. A pre-decoder data check entity may check for errors based on EC bits and systematic and parity bits from the UW-EC encoded signal. If an error is not detected at the pre-decoder data check entity, data without an error may be signaled to a source decoder without channel decoding.

Abstract: The present invention provides a supercritical carbon dioxide core fracturing holder under pore pressure saturation, including a holding sleeve; a left end sleeve and a right end sleeve are correspondingly embedded at the two end ports of the holding sleeve, and a fixed plug is docked to the left end sleeve; a moving plug movably passes through the right end sleeve, and a piston ring is formed on the outer side face of the moving plug; a sealing rubber sleeve for holding a test sample is disposed; two axial fluid injection pipelines are correspondingly disposed within the fixed plug and the moving plug; and an axial displacement measuring device is disposed between the outer end of the right end sleeve and the moving plug, and a fluid injection chamber is formed between the inner wall of the holding sleeve and the outer side face of the sealing rubber sleeve.

Abstract: A clamping component is provided to clamp a chip module, which has a circuit board and a protruding portion protruding upward from an upper surface thereof. In a left-right direction, a width of a first region from a left side of the circuit board to a left side of the protruding portion is greater than that of a second region from a right side of the circuit board to a right side of the protruding portion. Two abutting surfaces respectively abut the left and the right sides of the circuit board. A stopping block is located at a left side of an opening, and extends rightward to the left side of the protruding portion and beyond the left side of the circuit board. When the chip module is installed in the clamping component and the circuit board abuts the abutting surfaces, the stopping block is located above the first region.