Patents by Inventor Lina Karam

Lina Karam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11030485
    Abstract: Embodiments of a deep learning enabled generative sensing and feature regeneration framework which integrates low-end sensors/low quality data with computational intelligence to attain a high recognition accuracy on par with that attained with high-end sensors/high quality data or to optimize a performance measure for a desired task are disclosed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 8, 2021
    Assignee: Arizona Board of Regents on Behalf of Arizona State University
    Inventors: Lina Karam, Tejas Borkar
  • Publication number: 20190303720
    Abstract: Embodiments of a deep learning enabled generative sensing and feature regeneration framework which integrates low-end sensors/low quality data with computational intelligence to attain a high recognition accuracy on par with that attained with high-end sensors/high quality data or to optimize a performance measure for a desired task are disclosed.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 3, 2019
    Applicant: Arizona Board of Regents on Behalf of Arizona State University
    Inventors: Lina Karam, Tejas Borkar
  • Patent number: 9704232
    Abstract: A method for automatic, stereo vision based, in-line solder ball height and substrate coplanarity inspection includes providing an imaging setup together with an imaging processor for reliable, in-line solder ball height measurement. The imaging set up includes a pair of cameras mounted at two opposing angles with ring lighting around each camera lens, which allows the capture of two images of an electronics package in parallel. The lighting generates features on solder balls located on a substrate of the electronics package, which are then used to determine height. Specifically, points with the same intensity on each solder ball surface are grouped, which allows for the formation of curves, also known as iso-contours, which are then matched between the two views. An optimized triangulation is then performed to determine the height of each one of the solder balls.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: July 11, 2017
    Assignee: Arizona Board of Regents of Behalf of Arizona State University
    Inventors: Lina Karam, Jinjin Li
  • Patent number: 9501710
    Abstract: Systems, methods, and media for optical recognition are provided. In some embodiments, systems for optical recognition are provided, the systems comprising: at least one hardware processor that: identifies a plurality of fixation points in optically detected data; identifies features of the plurality of fixation points; and identifies one or more characteristics of an object represented in the optically detected data. In some embodiments, methods for optical recognition are provided, the methods comprising: identifying a plurality of fixation points in optically detected data using a hardware processor; identifying features of the plurality of fixation points using the hardware processor; and identifying one or more characteristics of an object represented in the optically detected data using the hardware processor.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: November 22, 2016
    Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, acting for and on behalf of Arizona State University
    Inventors: Lina Karam, Samuel Dodge
  • Publication number: 20150269723
    Abstract: A method for automatic, stereo vision based, in-line solder ball height and substrate coplanarity inspection includes providing an imaging setup together with an imaging processor for reliable, in-line solder ball height measurement. The imaging set up includes a pair of cameras mounted at two opposing angles with ring lighting around each camera lens, which allows the capture of two images of an electronics package in parallel. The lighting generates features on solder balls located on a substrate of the electronics package, which are then used to determine height. Specifically, points with the same intensity on each solder ball surface are grouped, which allows for the formation of curves, also known as iso-contours, which are then matched between the two views. An optimized triangulation is then performed to determine the height of each one of the solder balls.
    Type: Application
    Filed: March 18, 2015
    Publication date: September 24, 2015
    Applicant: Arizona Board of Regents on behalf of Arizona State University
    Inventors: Lina Karam, Jinjin Li
  • Publication number: 20140016859
    Abstract: Systems, methods, and media for optical recognition are provided. In some embodiments, systems for optical recognition are provided, the systems comprising: at least one hardware processor that: identifies a plurality of fixation points in optically detected data; identifies features of the plurality of fixation points; and identifies one or more characteristics of an object represented in the optically detected data. In some embodiments, methods for optical recognition are provided, the methods comprising: identifying a plurality of fixation points in optically detected data using a hardware processor; identifying features of the plurality of fixation points using the hardware processor; and identifying one or more characteristics of an object represented in the optically detected data using the hardware processor.
    Type: Application
    Filed: July 1, 2013
    Publication date: January 16, 2014
    Inventors: Lina Karam, Samuel Dodge
  • Publication number: 20080259796
    Abstract: Methods and devices for a media processing is provided. In one respect, the methods can provide initiating a bandwidth throttle or a frame rate throttle when resources of a network exceed resources of client device. The methods of the present disclosure may also provide techniques for handling lost packets during transmission using wavelet coefficients.
    Type: Application
    Filed: April 17, 2008
    Publication date: October 23, 2008
    Inventors: Glen Patrick Abousleman, Wei-Jung Chien, Lina Karam