Patents by Inventor Linas Repecka

Linas Repecka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6911175
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: June 28, 2005
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Publication number: 20040104516
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Application
    Filed: November 12, 2003
    Publication date: June 3, 2004
    Applicant: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Patent number: 6676882
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: January 13, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Publication number: 20030042659
    Abstract: A method provides for full or partial infusion of resin into three-dimensional, woven textile preforms. Resin film is placed at selected locations adjacent the preform, and the resin film may be separated from other areas of the preform using separator sheets or other materials. The preform is heated and may be vacuum-bagged to apply pressure, or may be rolled or fed through a die. The heat and pressure cause the resin to infuse into the selected areas of the preform adjacent the resin films. The amount of resin in the partial infusion is the same as is necessary to fully infuse the preform, but the resin remains localized in the selected areas until heated again at cure to cause the resin to flow throughout the preform. The method may also be used to fully infuse the preform with resin by providing sufficient temperature and time at that temperature during the initial infusion.
    Type: Application
    Filed: August 28, 2001
    Publication date: March 6, 2003
    Inventors: Ross A. Benson, Larry R. Bersuch, Harry R. Miller, Ronald P. Schmidt, Linas Repecka
  • Patent number: 6391436
    Abstract: The invention provides a method of forming a void-free laminate, comprising the steps of: (a) enclosing a partially impregnated prepreg in a vacuum envelope, said partially impregnated prepreg comprising a fiber layer partially impregnated with a resin composition; and (b) heating said partially impregnated prepreg under vacuum to withdraw air present in said partially impregnated prepreg and to cause said resin composition (i) to fully infuse into said fiber layer and (ii) to cure thereby forming said void-free laminate. The present invention further provides novel combinations of modified epoxy resins that may be employed with the methods disclosed. The void-free laminates may be utilized for the manufacture of parts for the aerospace and aircraft industries.
    Type: Grant
    Filed: May 20, 1999
    Date of Patent: May 21, 2002
    Assignee: Cytec Technology Corp.
    Inventors: Guo Feng Xu, Linas Repecka, Steve Mortimer, Steve Peake, Jack Boyd