Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A resonant circuit and a control method thereof, the resonant circuit including a plurality of resonant modules connected in parallel. The control method includes: obtaining an output current signal and an output voltage signal according to an output current and an output voltage sampled of the respective resonant module; correspondingly generating, via the respective resonant module, a first control voltage signal through a voltage loop according to a current difference between the output current and an average output current and the output voltage signal, and correspondingly generating a second control voltage signal through a current loop according to the output current signal; selecting to use one of the first or second control voltage signal according to whether the output current reaches the current limit value for controlling a switch frequency of the corresponding resonant module, thereby achieving current-sharing or current-limiting control of the respective resonant module.

Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.

Abstract: The present disclosure relate to a fault diagnosis method, including: collecting at least one set of original data of the high voltage generator during operation, each condition attribute in a condition attribute set corresponding to one piece of original data; pre-processing the original data to obtain pre-processed data and generating a decision table; performing an attribute reduction based on the decision table to obtain a reduced condition attribute set and a reduced decision table; generating a decision tree model according to the reduced decision table; generating a decision forest model according to at least one decision tree model; obtaining a fault type and a fault level according to the decision forest model; determining an acceptable level of the fault according to the fault level and a frequency of occurrence of the same type of fault, and sending the fault type and the acceptable level to the display terminal.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: The present disclosure relate to a fault diagnosis method, including: collecting at least one set of original data of the high voltage generator during operation, each condition attribute in a condition attribute set corresponding to one piece of original data; pre-processing the original data to obtain pre-processed data and generating a decision table; performing an attribute reduction based on the decision table to obtain a reduced condition attribute set and a reduced decision table; generating a decision tree model according to the reduced decision table; generating a decision forest model according to at least one decision tree model; obtaining a fault type and a fault level according to the decision forest model; determining an acceptable level of the fault according to the fault level and a frequency of occurrence of the same type of fault, and sending the fault type and the acceptable level to the display terminal.

Abstract: A method for controlling a power supply includes: acquiring working state information of the power supply in a current operation; determining whether a state value of the power supply in the current operation satisfies a preset condition according to the working state information; setting a first control strategy for controlling the current operation of the power supply as a second control strategy when the preset condition is satisfied; storing the state value in the current operation and the first control strategy of the power supply in the current operation when the preset condition is not satisfied, and modifying the first control strategy to obtain the second control strategy according to an adjustment strategy; and loading the second control strategy from the machine-learning control circuitry in next operation, and controlling the next operation of the power supply according to the second control strategy.

Abstract: A method for controlling a power supply includes: acquiring working state information of the power supply in a current operation; determining whether a state value of the power supply in the current operation satisfies a preset condition according to the working state information; setting a first control strategy for controlling the current operation of the power supply as a second control strategy when the preset condition is satisfied; storing the state value in the current operation and the first control strategy of the power supply in the current operation when the preset condition is not satisfied, and modifying the first control strategy to obtain the second control strategy according to an adjustment strategy; and loading the second control strategy from the machine-learning control circuitry in next operation, and controlling the next operation of the power supply according to the second control strategy.