Patents by Inventor Linda A. Domeier
Linda A. Domeier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8808588Abstract: Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity, which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate, which may include microchannels or other features.Type: GrantFiled: February 4, 2008Date of Patent: August 19, 2014Assignee: Sandia CorporationInventors: Blake Simmons, Linda Domeier, Noble Woo, Timothy Shepodd, Ronald F. Renzi
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Patent number: 7465419Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.Type: GrantFiled: May 24, 2006Date of Patent: December 16, 2008Assignee: Sandia CorporationInventors: Alfredo M. Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry J. Garino
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Patent number: 7390377Abstract: We demonstrate a new method for joining patterned thermoplastic parts into layered structures. The method takes advantage of case-II permeant diffusion to generate dimensionally controlled, activated bonding layers at the surfaces being joined. It is capable of producing bonds characterized by cohesive failure while preserving the fidelity of patterned features in the bonding surfaces. This approach is uniquely suited to production of microfluidic multilayer structures, as it allows the bond-forming interface between plastic parts to be precisely manipulated at micrometer length scales. The bond enhancing procedure is easily integrated in standard process flows and requires no specialized equipment.Type: GrantFiled: September 22, 2005Date of Patent: June 24, 2008Assignee: Sandia CorporationInventors: Thomas I. Wallow, Marion C. Hunter, Karen Lee Krafcik, Alfredo M. Morales, Blake A. Simmons, Linda A. Domeier
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Patent number: 7351380Abstract: Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features.Type: GrantFiled: January 8, 2004Date of Patent: April 1, 2008Assignee: Sandia CorporationInventors: Blake Simmons, Linda Domeier, Noble Woo, Timothy Shepodd, Ronald F. Renzi
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Patent number: 7090189Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.Type: GrantFiled: August 15, 2002Date of Patent: August 15, 2006Assignee: Sandia National LaboratoriesInventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
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Patent number: 6929733Abstract: A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: GrantFiled: April 24, 2002Date of Patent: August 16, 2005Assignee: Sandia CorporationInventors: Linda A. Domeier, Jill M. Hruby, Alfredo M. Morales
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Publication number: 20050151371Abstract: Injection molding is used to form microfluidic devices with integrated functional components. One or more functional components are placed in a mold cavity which is then closed. Molten thermoplastic resin is injected into the mold and then cooled, thereby forming a solid substrate including the functional component(s). The solid substrate including the functional component(s) is then bonded to a second substrate which may include microchannels or other features.Type: ApplicationFiled: January 8, 2004Publication date: July 14, 2005Inventors: Blake Simmons, Linda Domeier, Noble Woo, Timothy Shepodd, Ronald Renzi
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Patent number: 6679471Abstract: A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: GrantFiled: January 17, 2002Date of Patent: January 20, 2004Assignee: Sandia National LaboratoriesInventors: Linda A. Domeier, Alfredo M. Morales, Marcela G. Gonzales, Patrick M. Keifer
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Publication number: 20030057096Abstract: A compliant cantilevered three-dimensional micromold is provided. The compliant cantilevered micromold is suitable for use in the replication of cantilevered microparts and greatly simplifies the replication of such cantilevered parts. The compliant cantilevered micromold may be used to fabricate microparts using casting or electroforming techniques. When the compliant micromold is used to fabricate electroformed cantilevered parts, the micromold will also comprise an electrically conducting base formed by a porous metal substrate that is embedded within the compliant cantilevered micromold. Methods for fabricating the compliant cantilevered micromold as well as methods of replicating cantilevered microparts using the compliant cantilevered micromold are also provided.Type: ApplicationFiled: August 15, 2002Publication date: March 27, 2003Inventors: Alfredo Martin Morales, Linda A. Domeier, Marcela G. Gonzales, Patrick N. Keifer, Terry Joseph Garino
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Publication number: 20020179449Abstract: A sacrificial plastic mold having an electroplatable backing is provided as are methods of making such a mold via the infusion of a castable liquid formulation through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale master mold. Upon casting and demolding, the porous metal substrate is embedded within the cast formulation and projects a plastic structure with features determined by the mold tool. The plastic structure provides a sacrificial plastic mold mechanically bonded to the porous metal substrate, which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved, leaving the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: ApplicationFiled: January 17, 2002Publication date: December 5, 2002Inventors: Linda A. Domeier, Alfredo M. Morales, Marcela G. Gonzales, Patrick N. Keifer
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Patent number: 6472459Abstract: A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic microstructures so provided are then sintered.Type: GrantFiled: January 16, 2001Date of Patent: October 29, 2002Assignee: Sandia CorporationInventors: Alfredo M. Morales, Michael R. Winter, Linda A. Domeier, Shawn M. Allan, Dawn M. Skala
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Patent number: 6458263Abstract: In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.Type: GrantFiled: September 29, 2000Date of Patent: October 1, 2002Assignee: Sandia National LaboratoriesInventors: Alfredo Martin Morales, Linda A. Domeier
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Publication number: 20020117599Abstract: A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: ApplicationFiled: April 24, 2002Publication date: August 29, 2002Inventors: Linda A. Domeier, Jill M. Hruby, Alfredo M. Morales
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Patent number: 6422528Abstract: A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a micro-scale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: GrantFiled: January 17, 2001Date of Patent: July 23, 2002Assignee: Sandia National LaboratoriesInventors: Linda A. Domeier, Jill M. Hruby, Alfredo M. Morales
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Publication number: 20020092962Abstract: A sacrificial plastic mold having an electroplatable backing is provided. One embodiment consists of the infusion of a softened or molten thermoplastic through a porous metal substrate (sheet, screen, mesh or foam) and into the features of a microscale molding tool contacting the porous metal substrate. Upon demolding, the porous metal substrate will be embedded within the thermoplastic and will project a plastic structure with features determined by the mold tool. This plastic structure, in turn, provides a sacrificial plastic mold mechanically bonded to the porous metal substrate which provides a conducting support suitable for electroplating either contiguous or non-contiguous metal replicates. After electroplating and lapping, the sacrificial plastic can be dissolved to leave the desired metal structure bonded to the porous metal substrate. Optionally, the electroplated structures may be debonded from the porous substrate by selective dissolution of the porous substrate or a coating thereon.Type: ApplicationFiled: January 17, 2001Publication date: July 18, 2002Inventors: Linda A. Domeier, Jill M. Hruby, Alfredo M. Morales
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Publication number: 20010038803Abstract: A method is provided for fabricating metallic microstructures, i.e., microcomponents of micron or submicron dimensions. A molding composition is prepared containing an optional binder and nanometer size (1 to 1000 nm in diameter) metallic particles. A mold, such as a lithographically patterned mold, preferably a LIGA or a negative photoresist mold, is filled with the molding composition and compressed. The resulting microstructures are then removed from the mold and the resulting metallic micro structures so provided are then sintered.Type: ApplicationFiled: January 16, 2001Publication date: November 8, 2001Inventors: Alfredo M. Morales, Michael R. Winter, Linda A. Domeier, Shawn M. Allan, Dawn M. Skala
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Patent number: 5364700Abstract: Described herein are novel rubber modified bismaleimide resins and prepregable resin compositions comprising these bismaleimides and one or more liquid co-reactants and optionally, one or more other additives.Type: GrantFiled: December 27, 1985Date of Patent: November 15, 1994Assignee: Amoco CorporationInventor: Linda A. Domeier
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Patent number: 5216173Abstract: Polyfunctional N-cyanoimides and their precursors and derivatives are disclosed along with methods for their preparation and interconversion. Also disclosed are curable compositions comprising the N-cyanoimides or poly(amide-cyanoamides) and reactive diluents as well as novel dianhydrides, polyimides, and poly(amide-cyanoamides) and methods for making them.Type: GrantFiled: July 23, 1990Date of Patent: June 1, 1993Assignee: Henkel Research CorporationInventors: Randall Stephens, Linda A. Domeier
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Patent number: 5015701Abstract: Described herein are curable molding compositions comprising a mixture of:(a) a vinyl ester produced by the addition of an unsaturated monocarboxylic acid to a polyepoxide and having a molecular weight greater than 300;(b) acrylic or methacrylic acid or a functionalized derivative thereof having a molecular weight of less than 300;(c) an ethylenically unsaturated monomer which is soluble in and copolymerizable with (a) and (b) and which is different from (b).The compositions can also contain one or more fibers with a melting point or a glass transition temperature above about 130.degree. C.Type: GrantFiled: July 26, 1985Date of Patent: May 14, 1991Assignee: Union Carbide Chemicals and Plastics Company Inc.Inventor: Linda A. Domeier
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Patent number: 4857579Abstract: Described herein are curable molding compositions comprising a mixture of:I. from about 25 to about 90 weight percent of a thermosetting resin containing:(a) from about 5 to about 95 weight percent of a polyester resin derived from the reaction of a poly(acrylate) and a vinyl monomer, said poly(acrylate) and vinyl monomer essentially free from functional groups reactive with the polyol or the polyisocyanate of (b);(b) from about 95 to about 5 weight percent of a polyurethane derived from the reaction of a saturated polyol and a polyisocyanate, said polyol and polyisocyanate free from unsaturated groups capable of copolymerizing with the poly(acrylate) or vinyl monomer of (a); andII. from about 75 to about 10 weight percent of one or more fibers with a melting point or a glass transition temperature above about 130.degree. C.; wherein (b) constitutes less than 40 weight percent of (I) and (II).Type: GrantFiled: November 25, 1987Date of Patent: August 15, 1989Assignee: Union Carbide CorporationInventor: Linda A. Domeier