Patents by Inventor Linda F. Reynolds-Heffer

Linda F. Reynolds-Heffer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling an optoelectronic device
    Patent number: 8246867
    Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: August 21, 2012
    Assignee: Corning Incorporated
    Inventors: John W. Botelho, Diane K. Guilfoyle, Linda F. Reynolds-Heffer, Brian P. Strines, Kathleen A. Wexell
  • METHODS FOR ASSEMBLING AN OPTOELECTRONIC DEVICE
    Publication number: 20110089587
    Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Inventors: John W. Botelho, Diane K. Guilfoyle, Linda F. Reynolds-Heffer, Brian P. Strines, Kathleen A. Wexell