Abstract: An improved integrated circuit structure is disclosed wherein a first metal layer is coated with a dielectric material and another metal layer is applied over the dielectric layer and a via electrically interconnects at least a portion of the first metal layer with at least a portion of the second metal layer. The via is formed having a lower first width dimension adjacent the first metal layer and an upper enlarged width portion adjacent the second metal layer formed by masking the dielectric with a mask having an opening conforming to the first dimension and isotropically etching the dielectric through the mask to provide the enlarged portion adjacent the upper surface of the dielectric.

Abstract: A process is disclosed for the planarization of an integrated circuit structure by a two stage planarization process which comprises: applying over a metallization layer, having one or more openings therein, a layer of insulation sufficiently thin to avoid formation of voids in the portion of the insulation applied in the openings in the metallization layer; smoothing the insulation layer by removing the high portions of the insulation by, for example, dry etching the insulation; applying a further layer of insulation over the first insulation layer; and smoothing the further layer of insulation by removing the high portions by, for example, dry etching; whereby the resultant smoothed insulation surface will be substantially planar and substantially void-free.