Abstract: A hair cutting device (10) comprises a first arm (12) having (i) a first arm proximal end (20), (ii) a first arm distal end (22), (iii) a first arm connected section (24), (iv) a first arm diverging section (26), (v) a first arm converging section (28), (vi) a cutting surface (52), and (vii) a first arm width (12W); and an opposed second arm (14) having (i) a second arm proximal end (38), (ii) a second arm distal end (40), (iii) a second arm connected section (42), (iv) a second arm diverging section (44), (v) a second arm converging section (46), (vi) a cutting blade (54), and (vii) a second arm width (14W). The second arm width (14W) is narrower than the first arm width (12W) through a substantial entirety of the second arm converging section (46) and the first arm converging section (28).

Abstract: A hair cutting device (10) comprises a first arm (12) having (i) a first arm proximal end (20), (ii) a first arm distal end (22), (iii) a first arm connected section (24), (iv) a first arm diverging section (26), (v) a first arm converging section (28), (vi) a cutting surface (52), and (vii) a first arm width (12W); and an opposed second arm (14) having (i) a second arm proximal end (38), (ii) a second arm distal end (40), (iii) a second arm connected section (42), (iv) a second arm diverging section (44), (v) a second arm converging section (46), (vi) a cutting blade (54), and (vii) a second arm width (14W). The second arm width (14W) is narrower than the first arm width (12W) through a substantial entirety of the second arm converging section (46) and the first arm converging section (28).

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluoroethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A technique for the remote installation of application software from a source computer system to one or more target computer systems (workstation) coupled to a Local Area Network (LAN). The present invention allows a LAN Administrator to install application software on a user's workstation automatically at any time without user's intervention. The state of (i.e. a snapshot of) the LAN Administrator's system before and after the installation of the application software is captured and an installation package is built. Installation on the user workstations is then scheduled. For installation, the installation package is transmitted to the user workstation where an install program carries out commands in the installation package for installing the application software.

Abstract: A semiconductor package for power transistors and the like has a heat sink flange with at least one die mounted thereon, a non-ceramic based window frame mounted thereon adjacent the die, and a plurality of leads mounted on the window frame and electrically coupled to the die by wire bonds. The non-ceramic based window frame is thermally matched to copper or other highly conductive material typically used for the flange, to facilitate assembly of the semiconductor package at high temperatures. The non-ceramic based window frame is flexible and is thermally matched to the highly conductive flange so as to expand and contract at a rate similar to the flange to prevent failure during assembly of the semiconductor package. The non-ceramic based material of the window frame includes a matrix of principally organic material, such as polytetrafluorethylene, filled with fibers which may be glass fibers or ceramic fibers.

Abstract: A technique for the remote installation of application software from a source computer system to one or more target computer systems (workstation) coupled to a Local Area Network (LAN). The present invention allows a LAN Administrator to install application software on a user's workstation automatically at any time without user's intervention. The state of (i.e. a snapshot of) the LAN Administrator's system before and after the installation of the application software is captured and an installation package is built. Installation on the user workstations is then scheduled. For installation, the installation package is transmitted to the user workstation where an install program carries out commands in the installation package for installing the application software.

Abstract: A technique for the remote installation of application software from a source computer system to one or more target computer systems (workstation) coupled to a Local Area Network (LAN). The present invention allows a LAN Administrator to install application software on a user's workstation automatically at any time without user's intervention. The state of (i.e. a snapshot of) the LAN Administrator's system before and after the installation of the application software is captured and an installation package is built. Installation on the user workstations is then scheduled. For installation, the installation package is transmitted to the user workstation where an install program carries out commands in the installation package for installing the application software.

Abstract: A technique for the remote installation of application software from a source computer system to one or more target computer systems (workstation) coupled to a Local Area Network (LAN). The present invention allows a LAN Administrator to install application software on a user's workstation automatically at any time without user's intervention. The state of (i.e. a snapshot of) the LAN Administrator's system before and after the installation of the application software is captured and an installation package is built. Installation on the user workstations is then scheduled. For installation, the installation package is transmitted to the user workstation where an install program carries out commands in the installation package for installing the application software.