Abstract: A method for micro-machining a varactor that is part of a membrane suspended MEMS tunable filter. In one non-limiting embodiment, the method includes providing a main substrate; depositing a membrane on the main substrate; depositing and patterning a plurality of sacrificial photoresist layers at predetermined times during the fabrication of the varactor; depositing metal layers that define a fabricated varactor structure enclosed within photoresist; coupling a carrier substrate to the fabricated structure opposite to the main substrate using a release layer; etching a central portion of the main substrate to expose the membrane; removing the carrier substrate by dissolving the release layer in a material that attacks the release layer but does not dissolve the photoresist; and removing the photoresist layers to provide a released varactor.

Abstract: An antenna assembly that has particular application for a hand held reader that interrogates sensors embedded within a vehicle tire, such as RFID sensors and tire pressure sensors. In one embodiment, the antenna assembly includes a first antenna operating in the 432-435 MHz range that employs a meander-line slot that provides increased antenna cross-polarization so that the sensor can be interrogated regardless of the antenna orientation and polarization. The antenna assembly also includes two RFID antennas that operate in the 902-928 MHz range that are planar antenna that make the antenna bi-directional, polarization free and a wide enough bandwidth for the RFID interrogation.

Abstract: A transceiver array that employs vertically integrated circuits in one or more wafers. The array includes a digital wafer having digital circuits. A plurality of RF cubes are formed to the digital wafer, where each RF cube includes an antenna wafer and at least one lower wafer, and where each RF cube represents a separate channel of the array. The antenna wafer includes a patch antenna and a resonating cavity. The at least one lower wafer includes high frequency RF integrated circuits and intermediate frequency RF integrated circuits. The array has application as a front-end for a digital beam-forming system.

Abstract: A method for micro-machining a varactor that is part of a membrane suspended MEMS tunable filter. In one non-limiting embodiment, the method includes providing a main substrate; depositing a membrane on the main substrate; depositing and patterning a plurality of sacrificial photoresist layers at predetermined times during the fabrication of the varactor; depositing metal layers that define a fabricated varactor structure enclosed within photoresist; coupling a carrier substrate to the fabricated structure opposite to the main substrate using a release layer; etching a central portion of the main substrate to expose the membrane; removing the carrier substrate by dissolving the release layer in a material that attacks the release layer but does not dissolve the photoresist; and removing the photoresist layers to provide a released varactor.

Abstract: A polymer-based, self-aligned wafer-level heterogeneous integration system, SAWLIT, for integrating semiconductor integrated circuit (IC) chips to a substrate is presented. The system includes a method including preparing a substrate, flipping the substrate onto a polymer-based flat surface and securing the substrate to the flat surface, mounting semiconductor chips into the prepared substrate, integrating the chips to the substrate with another polymer-based material, and removing the resulting multi-chip module from the flat surface. The chips may then be connected with each other and regions off the multi-chip module with metal interconnect processing technology. A multi-chip module prepared by the polymer-based, self-aligned heterogeneous integration system including semiconductor chips mounted in a prepared substrate. The chips may be connected to the substrate by a polymer-based integrating material.

Abstract: A polymer-based, self-aligned wafer-level heterogeneous integration system, SA WLIT, for integrating semiconductor integrated circuit (IC) chips to a substrate is presented. The system includes a method including preparing a substrate, flipping the substrate onto a polymer-based flat surface and securing the substrate to the flat surface, mounting semiconductor chips into the prepared substrate, integrating the chips to the substrate with another polymer-based material, and removing the resulting multi-chip module from the flat surface. The chips may then be connected with each other and regions off the multi-chip module with metal interconnect processing technology. A multi-chip module prepared by the polymer-based, self-aligned heterogeneous integration system including semiconductor chips mounted in a prepared substrate. The chips may be connected to the substrate by a polymer-based integrating material.

Abstract: A speed measuring device that employs a Fresnel zone plate lens antenna. The Fresnel lens antenna is mounted to one end of a low profile collection housing, typically cylindrical in configuration. An opposite end of the collection housing includes a back plate having an opening. A transceiver unit is mounted to the outside surface of the back plate so that a transmitter and a detector within the transceiver are in communication with the opening. A signal is transmitted from the transceiver unit through the opening, and is directed by the lens antenna. A reflected signal is received and focused by the lens antenna, and collected by the housing to be directed through the opening to the transceiver.

Abstract: An antenna assembly that has particular application for a hand held reader that interrogates sensors embedded within a vehicle tire, such as RFID sensors and tire pressure sensors. In one embodiment, the antenna assembly includes a first antenna operating in the 432-435 MHz range that employs a meander-line slot that provides increased antenna cross-polarization so that the sensor can be interrogated regardless of the antenna orientation and polarization. The antenna assembly also includes two RFID antennas that operate in the 902-928 MHz range that are planar antenna that make the antenna bi-directional, polarization free and a wide enough bandwidth for the RFID interrogation.

Abstract: An evanescent mode resonator including a cavity formed in a substrate of semiconductor material. The resonator includes a capacitive post positioned within the cavity, and a tuning element positioned within the wall of the cavity proximate to the capacitive post, where a gap between the flexible element and the post sets the tuning of the resonator.

Abstract: A transceiver array that employs vertically integrated circuits in one or more wafers. The array includes a digital wafer having digital circuits. A plurality of RF cubes are formed to the digital wafer, where each RF cube includes an antenna wafer and at least one lower wafer, and where each RF cube represents a separate channel of the array. The antenna wafer includes a patch antenna and a resonating cavity. The at least one lower wafer includes high frequency RF integrated circuits and intermediate frequency RF integrated circuits. The array has application as a front-end for a digital beam-forming system.

Abstract: A stressed metal technology may fabricate high-Q, three-dimensional microelectronic inductors and transformers. The fabrication method may allow the production of inductors and transformers on high-resistivity silicon substrate and with metal deposition of Au and Cr that is fully compatible with semiconductor fabrication technologies. The produced inductors and transformers exhibit Q factors>60 at frequencies of 3 to 7 GHz. High efficiency, high-Q transformers with coupling factors 0.6<k<0.9 may be created with very high self-resonance frequencies.

Abstract: An apparatus and method to simultaneously measure electric and thermal fields with a single probe. Using an electrooptic semiconductor probe, the Pockels effect is employed to measure electric field magnitude and phase, and the effect of photon absorption due to bandtail states in the semiconductor is used to measure temperature. Techniques to scale relative electric-field measurements to absolute units (volts/meter), stabilize electric-field phase drift, and calibrate electric-field data that is corrupted when the probe is used in regions where temperature gradients exist are provided.

Abstract: A multifunction printed antenna for wireless and telematic applications. In one embodiment, GPS and satellite radio patch antenna elements are printed on one side of a printed circuit board and AMPS, PCS, GSM and terrestrial radio slot antenna elements are etched in a ground plane on an opposite side of the same printed circuit board. In an alternate embodiment, the GPS and satellite radio patch antenna elements are elements mounted on one printed circuit board and the AMPS, GSM, PCS and terrestrial radio slot antenna elements are etched in a ground plane on another printed circuit board rigidly secured orthogonal to the GPS and satellite printed circuit board.

Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallo-dielectric lattice. The measured and simulated results of 2-, 3- and 6-pole filters are presented at 10.7 GHz, along with the equivalent circuits.

Abstract: A multifunction printed antenna for wireless and telematic applications. In one embodiment, GPS and satellite radio patch antenna elements are printed on one side of a printed circuit board and AMPS, PCS, GSM and terrestrial radio slot antenna elements are etched in a ground plane on an opposite side of the same printed circuit board. In an alternate embodiment, the GPS and satellite radio patch antenna elements are elements mounted on one printed circuit board and the AMPS, GSM, PCS and terrestrial radio slot antenna elements are etched in a ground plane on another printed circuit board rigidly secured orthogonal to the GPS and satellite printed circuit board.

Abstract: An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first silicon wafer. A micro-electro-mechanical device is provided and coupled to the top surface of the first silicon wafer. An electrical feed line then extends along the bottom surface of the first silicon wafer and an electrical interconnect electrically couples the micro-electro-mechanical device and the electrical feed line through the bore.

Abstract: A microwave and millimeter-wave electric-field mapping system based on electro-optic sampling has been developed using micromachined Gallium Arsenide crystals mounted on gradient index lenses and single-mode optical fibers. The probes are able to detect three orthogonal polarizations of electric fields and, due to the flexibility and size of the optical fiber, can be positioned not only from the extreme near-field to the far-field regions of microwave and millimeter-wave structures, but also inside of enclosures such as waveguides and packages. A microwave electric-field-mapping system based on micromachined GaAs electro-optic sampling probes mounted on gradient index lenses and single-mode optical fibers can extract field images from the interior of an enclosed microwave cavity.

Abstract: A multifunction printed antenna for wireless and telematic applications. In one embodiment, GPS and satellite radio patch antenna elements are printed on one side of a printed circuit board and AMPS, PCS, GSM and terrestrial radio slot antenna elements are etched in a ground plane on an opposite side of the same printed circuit board. In an alternate embodiment, the GPS and satellite radio patch antenna elements are elements mounted on one printed circuit board and the AMPS, GSM, PCS and terrestrial radio slot antenna elements are etched in a ground plane on another printed circuit board rigidly secured orthogonal to the GPS and satellite printed circuit board. The AMPS, GSM and PCS circuit board can be curved to reduce the nulls at the edges of the circuit board. Further, the edge of the AMPS, GSM and PCS circuit board that contacts the GPS and satellite radio circuit board can have a saw-tooth pattern so that edge currents are reduced.

Abstract: An RF micro-electro-mechanical system including a first silicon wafer having a top surface and a bottom surface. The top surface being opposite the bottom surface. A bore extends through the first silicon wafer. A micro-electro-mechanical device is provided and coupled to the top surface of the first silicon wafer. An electrical feed line then extends along the bottom surface of the first silicon wafer and an electrical interconnect electrically couples the micro-electro-mechanical device and the electrical feed line through the bore.

Abstract: A method of planarizing a circuit surface is disclosed. The basic idea is to use the photoresist mask for etching as the mask for lift-off, i.e. after the substrate patterned with photoresist and dry etched, metal is directly deposited onto it and liftoff afterwards. Thus, the deposited metal is self aligned and filled into the etched pattern with a planar surface. It is important that the metal thickness should be the same as the etching depth. The lithography needs a special recipe and photoresist requires a special pre-treatment so that the metal can form a clean edge without any residual metal along the edge. A prototype using this invention, a MEMS switch, is introduced.