Patents by Inventor Linda S. Milor

Linda S. Milor has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detection of undesired connection between conductive structures within multiple layers on a semiconductor wafer
    Patent number: 6448098
    Abstract: The present invention is a device and method for detecting undesired connection between conductive structures within multiple layers on a semiconductor wafer during fabrication of an integrated circuit on the semiconductor wafer. The present invention includes a first conductive structure fabricated within a first layer on the semiconductor wafer and a second conductive structure fabricated within a second layer on the semiconductor wafer. The present invention also includes an interlevel of an insulating material disposed between the first layer and the second layer for separating the first layer from the second layer. The present invention further includes a contact structure of conductive material disposed within the interlevel of the insulating material.
    Type: Grant
    Filed: February 1, 2000
    Date of Patent: September 10, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Linda S. Milor
  • Detection of undesired connection between conductive structures within multiple layers on a semiconductor wafer
    Patent number: 6054721
    Abstract: The present invention is a device and method for detecting undesired connection between conductive structures within multiple layers on a semiconductor wafer during fabrication of an integrated circuit on the semiconductor wafer. The present invention includes a first conductive structure fabricated within a first layer on the semiconductor wafer and a second conductive structure fabricated within a second layer on the semiconductor wafer. The present invention also includes an interlevel of an insulating material disposed between the first layer and the second layer for separating the first layer from the second layer. The present invention further includes a contact structure of conductive material disposed within the interlevel of the insulating material.
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: April 25, 2000
    Assignee: Advanced Micro Devices, Inc.
    Inventor: Linda S. Milor