Patents by Inventor Linda Shekhawat

Linda Shekhawat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9669425
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: June 6, 2017
    Assignee: Intel Corporation
    Inventors: Linda Shekhawat, Nachiket Raravikar
  • Publication number: 20150367378
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 24, 2015
    Applicant: INTEL CORPORATION
    Inventors: Linda Shekhawat, Nachiket Raravikar
  • Patent number: 9159464
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: October 13, 2015
    Assignee: Intel Corporation
    Inventors: Linda Shekhawat, Nachiket Raravikar
  • Publication number: 20130216828
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Application
    Filed: March 28, 2013
    Publication date: August 22, 2013
    Inventors: Linda Shekhawat, Nachiket Raravikar
  • Patent number: 8409665
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: April 2, 2013
    Assignee: Intel Corporation
    Inventors: Linda A. Shekhawat, Nachiket R. Raravikar
  • Patent number: 8354467
    Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: January 15, 2013
    Assignee: Intel Corporation
    Inventors: Linda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Anathakrishan
  • Publication number: 20120141664
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Application
    Filed: February 13, 2012
    Publication date: June 7, 2012
    Inventors: Linda A. Shekhawat, Nachiket R. Raravikar
  • Patent number: 8173259
    Abstract: Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanaparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: May 8, 2012
    Assignee: Intel Corporation
    Inventors: Lakshmi Supriya, Linda A. Shekhawat
  • Patent number: 8133585
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: March 13, 2012
    Assignee: Intel Corporation
    Inventors: Linda A. Shekhawat, Nachiket R. Raravikar
  • Publication number: 20110136941
    Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
    Type: Application
    Filed: February 11, 2011
    Publication date: June 9, 2011
    Inventors: Linda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Ananthakrishan
  • Patent number: 7926697
    Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: April 19, 2011
    Assignee: Intel Corporation
    Inventors: Linda Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Ananthakrishan
  • Publication number: 20100035063
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Application
    Filed: October 5, 2009
    Publication date: February 11, 2010
    Inventors: Linda A. Shekhawat, Nachiket R. Raravikar
  • Patent number: 7651020
    Abstract: Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of amphiphilic block copolymer elements. The amphiphilic block copolymer elements each include at least one non-polar region and at least one polar region. A fluxing agent is contained within the micellar structures. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: January 26, 2010
    Assignee: Intel Corporation
    Inventors: Linda A. Shekhawat, Anna M. Prakash
  • Patent number: 7618679
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: November 17, 2009
    Assignee: Intel Corporation
    Inventors: Linda Shekhawat, Nachiket R. Raravikar
  • Publication number: 20090169721
    Abstract: Embodiments include materials which may be used during electronic device fabrication, including a flux material. The flux material comprises a solution including a plurality of micellar structures in a solvent, the micellar structures each including a plurality of amphiphilic block copolymer elements. The amphiphilic block copolymer elements each include at least one non-polar region and at least one polar region. A fluxing agent is contained within the micellar structures. Other embodiments are described and claimed.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Inventors: Linda A. SHEKHAWAT, Anna M. PRAKASH
  • Publication number: 20090170247
    Abstract: Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed.
    Type: Application
    Filed: December 28, 2007
    Publication date: July 2, 2009
    Inventors: Linda A. SHEKHAWAT, Gregory S. CONSTABLE, Youzhi E. XU, Nisha ANANTHAKRISHNAN
  • Publication number: 20090087644
    Abstract: Methods and associated structures of forming microelectronic devices are described. Those methods may include forming a first layer of functionalized nanoparticles on a substrate by immersing the substrate in at least one of a solvent and a polymer matrix, wherein at least one of the solvent and the polymer matrix comprises a plurality of functionalized nanoparticles; and forming a second layer of functionalized nanoparticles on the first layer of functionalized particles, wherein there is a gradient in a property between the first layer and the second layer.
    Type: Application
    Filed: September 27, 2007
    Publication date: April 2, 2009
    Inventors: Lakshmi Supriya, Linda A. Shekhawat
  • Publication number: 20090076220
    Abstract: An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 19, 2009
    Inventors: Linda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Ananthakrishan
  • Publication number: 20090061125
    Abstract: A thermally and electrically conductive structure comprises a carbon nanotube (110) having an outer surface (111) and a carbon coating (120) covering at least a portion of the outer surface of the carbon nanotube. The carbon coating may be applied to the carbon nanotube by providing a nitrile-containing polymer, coating the carbon nanotube with the nitrile-containing polymer, and pyrolyzing the nitrile-containing polymer in order to form the carbon coating on the carbon nanotube. The carbon nanotube may further be coated with a low contact resistance layer (130) exterior to the carbon coating and a metal layer (140) exterior to the low contact resistance layer.
    Type: Application
    Filed: August 27, 2007
    Publication date: March 5, 2009
    Inventors: Linda A. Shekhawat, Nachiket R. Raravikar