Patents by Inventor Linda Yi-Ping Zhu

Linda Yi-Ping Zhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyalkylene glycol-grafted polycarboxylate suspension and dispersing agent for cutting fluids and slurries
    Patent number: 9217118
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: December 22, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Linda Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, David B. Wurm
  • Cutting fluids with improved performance
    Patent number: 8980809
    Abstract: The cutting of semiconducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: March 17, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Wanglin Yu, Daniel A. Aguilar, John B. Cuthbert, Linda Yi-Ping Zhu
  • Polyalkylene Glycol-Grafted Polycarboxylate Suspension and Dispersing Agent for Cutting Fluids and Slurries
    Publication number: 20120214385
    Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.
    Type: Application
    Filed: October 16, 2009
    Publication date: August 23, 2012
    Inventors: Linda Yi-Ping Zhu, Wanglin Yu, Fang Li, Daniel A. Aguilar, David B. Wurm
  • Cutting Fluids with Improved Performance
    Publication number: 20120196779
    Abstract: The cutting of semi-conducting crystals with a wire saw is facilitated with a cutting fluid comprising a polyalkylene glycol neutralized with an un-neutralized or partially neutralized polymeric acid that has a molecular weight of 500 to 1,000,000 and contains more than three acid groups per molecule.
    Type: Application
    Filed: October 16, 2009
    Publication date: August 2, 2012
    Inventors: Wanglin Yu, Daniel A. Aguilar, John B. Cuthbert, Linda Yi-Ping Zhu
  • Aqueous Cutting Fluid for Use with a Diamond Wiresaw
    Publication number: 20120186571
    Abstract: Water-based cutting fluids for use with diamond wiresaws that are used for cutting or otherwise treating hard brittle materials, e.g., silicon ingots, comprise: A. Water-soluble, polymeric dispersing agent, typically a polycarboxylate; B. Optionally wetting agent; C. Optionally defoamer; B. Optionally corrosion inhibitor; E. Optionally chelant; F. Optionally biocide; and G. Water. Typically water comprises at least 50 weight percent of the fluid, and the polycarboxylate is grafted with a polyalkylene glycol, e.g., polyethylene glycol.
    Type: Application
    Filed: October 16, 2009
    Publication date: July 26, 2012
    Inventors: Linda Yi-Ping Zhu, Henry Huan Chen, Wanglin Yu, Richard Yun Fei Yan, Fang Li