Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

Abstract: Example embodiments disclosed herein relate to configuring a flexible port. The configuration of a computing device is detected based on a coupling of an interface to a flexible input/output port. The flexible input/output port is configured based on the detected configuration of the computing device.

Abstract: Example embodiments disclosed herein relate to configuring a flexible port. The configuration of a computing device is detected based on a coupling of an interface to a flexible input/output port. The flexible input/output port is configured based on the detected configuration of the computing device.

Abstract: Disclosed herein is a temperature monitoring system including a circuit board and a thermochromic coating covering at least a portion of the circuit board, wherein the thermochromic coating is capable of indicating a temperature gradient on the circuit board. The thermochromic coating may comprise a color forming leuco dye, an activator, and optionally a deprotecting agent.

Abstract: A computer includes a motherboard having first and second sets of expansion card slots, an expansion card bulkhead defining expansion card openings, and a configurable alignment mechanism operable to place the motherboard and the expansion card openings into first and second configurations relative to one another. In the first configuration, the first set of expansion card slots is aligned with the openings. In the second configuration, the second set of expansion card slots is aligned with the openings.

Abstract: A printed-circuit board (PCB) test jack comprises a body portion adapted for mounting on the top surface of a PCB and to provide mechanical support and signal and ground connections to an external test probe. At least one surface mount ground conductor is connected to and extends from the body portion to provide the ground connection; the ground conductors are arrayed for attaching to corresponding surface pads on the PCB's top surface. A single through-hole pin for insertion into a corresponding through-hole on the PCB is electrically isolated from the surface mount ground conductors and is connected to the body portion for providing the signal connection.

Abstract: A printed circuit board (PCB) test jack is presented that reduces the number of PCB through-holes required for its mounting, thereby reducing signal routing interference for high-density multi-layer PCBs. The present test jack comprises a body portion arranged to interface with an external test probe, at least one surface mount conductor connected to the body portion and arrayed for attaching to corresponding surface pads on the surface of a PCB, and a signal conductor connected to the body portion. The signal conductor comprises a single through-hole pin for insertion into a corresponding single through-hole on the PCB. Using only a single through-hole pin reduces signal routing interference in the PCB when compared with a test jack employing multiple through-hole pins. Alternatively, a test jack in accordance with the present invention may employ no through-hole pins.