Patents by Inventor Lindsay D. Corbet
Lindsay D. Corbet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11769940Abstract: An electronic device includes a display, and a housing at least partially surrounding the display and comprising a first housing member defining a first portion of an exterior surface of the electronic device and a second housing member defining a second portion of the exterior surface of the electronic device and configured to function as an antenna. The electronic device also includes a joining structure positioned between the first housing member and the second housing member including a reinforcement plate and a molded element at least partially encapsulating the reinforcement plate and engaged with the first housing member and the second housing member, thereby retaining the first housing member to the second housing member.Type: GrantFiled: December 7, 2021Date of Patent: September 26, 2023Assignee: APPLE INC.Inventors: Nicholas A. Renda, Carlo Catalano, Chen Wang, David R. Cramer, Kellen M. Atom, Lindsay D. Corbet, Melody L. Kuna, Robert J. Durand, Stephanie L. Ternullo, Sunita Venkatesh, Suvrat Lele, Wang Chung Alston Cheung
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Publication number: 20230072518Abstract: An electronic device includes a display, and a housing at least partially surrounding the display and comprising a first housing member defining a first portion of an exterior surface of the electronic device and a second housing member defining a second portion of the exterior surface of the electronic device and configured to function as an antenna. The electronic device also includes a joining structure positioned between the first housing member and the second housing member including a reinforcement plate and a molded element at least partially encapsulating the reinforcement plate and engaged with the first housing member and the second housing member, thereby retaining the first housing member to the second housing member.Type: ApplicationFiled: December 7, 2021Publication date: March 9, 2023Inventors: Nicholas A. Renda, Carlo Catalano, Chen Wang, David R. Cramer, Kellen M. Atom, Lindsay D. Corbet, Melody L. Kuna, Robert J. Durand, Stephanie L. Ternullo, Sunita Venkatesh, Suvrat Lele, Wang Chung Alston Cheung
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Patent number: 10897825Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: GrantFiled: March 16, 2020Date of Patent: January 19, 2021Assignee: APPLE INC.Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Publication number: 20200221583Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: ApplicationFiled: March 16, 2020Publication date: July 9, 2020Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Patent number: 10617016Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: GrantFiled: March 8, 2019Date of Patent: April 7, 2020Assignee: APPLE INC.Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Publication number: 20190208648Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: ApplicationFiled: March 8, 2019Publication date: July 4, 2019Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Patent number: 10264685Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: GrantFiled: February 5, 2018Date of Patent: April 16, 2019Assignee: APPLE INC.Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Publication number: 20180160551Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: ApplicationFiled: February 5, 2018Publication date: June 7, 2018Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Patent number: 9989992Abstract: An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.Type: GrantFiled: August 21, 2015Date of Patent: June 5, 2018Assignee: APPLE INC.Inventors: Houtan R. Farahani, Hsinhan Wu, Lindsay D. Corbet, Hilbert T. Kwan, Katherine Spriggs, You Fu Tan
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Patent number: 9951425Abstract: The described embodiments relate generally to methods for enhancing cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line with a cosmetic surface portion of the friction stir processed parts. In some embodiments cold spray can be used to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.Type: GrantFiled: July 24, 2014Date of Patent: April 24, 2018Assignee: Apple Inc.Inventors: Simon R. Lancaster-Larocque, Collin D. Chan, Kenneth A. Ross, Lindsay D. Corbet, Ari P. Miller, Thomas G. Budd
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Patent number: 9907191Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: GrantFiled: September 29, 2016Date of Patent: February 27, 2018Assignee: APPLE INC.Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Publication number: 20170094811Abstract: A housing for an electronic device that allows electromagnetic waves to pass through the housing is disclosed. The housing may include a first portion having an opening, a second portion positioned within the opening, and an insert including a protrusion extending into at least a portion of a gap formed between the first portion and the second portion. The housing also may include a first ink layer disposed within the gap and substantially surrounding the protrusion, and a second ink layer disposed within the gap and over the first ink. The first portion, second ink layer, and second portion may cooperate to form a substantially contiguous surface, and the second ink layer may be positioned approximately 5 microns (?m) or less below an exposed surface of the first portion and an exposed surface of the second portion.Type: ApplicationFiled: September 29, 2016Publication date: March 30, 2017Inventors: Ming Kun Shi, Lindsay D. Corbet, Christopher Bruni, Collin D. Chan
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Publication number: 20160209870Abstract: An enclosure for a portable computing device is disclosed. The enclosure includes an indicium (e.g., logo) positioned in an opening extending partially through the enclosure. The enclosure includes multiple material removal processes. First, a tool (e.g., laser ablation tool) can be used to ablate the opening defining an ablation having a shape or profile similar to that of the indicium. A second material removal process can remove a region within the ablation to define an indicium support. The second material removal process may be performed by a CNC cutting tool capable of forming the indicium support to a desired precision. As a result, when the indicium is secured with the indicium support, the indicium includes a desired flatness that prevents an undesired reflectivity. In order to ensure the indicium properly fits in the opening, a third material removal process may be performed to define an indention region around the opening.Type: ApplicationFiled: August 21, 2015Publication date: July 21, 2016Inventors: Houtan R. Farahani, Hsinhan Wu, Lindsay D. Corbet, Hilbert T. Kwan, Katherine Spriggs, You Fu Tan
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Publication number: 20150030379Abstract: The described embodiments relate generally to methods to enhance cosmetic surfaces of friction stir processed parts. More specifically a method for applying cold spray over a weld line generated by the friction stir processing is disclosed. Methods are also disclosed for blending the cold spray applied over the weld line in with a cosmetic surface portion of friction stir processed parts. In some embodiments cold spray can be used to on its own to create a cosmetic joint between various parts. Structural joints between first and second substrates may also be formed via solid state deposition. Such joints may be strengthened through use of a hidden weld, mechanical interlocking between the substrates, and/or coupling via fasteners.Type: ApplicationFiled: July 24, 2014Publication date: January 29, 2015Inventors: Simon R. Lancaster-Larocque, Collin D. Chan, Kenneth A. Ross, Lindsay D. Corbet, Ari P. Miller, Thomas G. Budd