Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.

Abstract: An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

Abstract: A camera control method and a terminal the method including starting, by a terminal, a first camera and a second camera, where the first camera and the second camera are located on a same side of the terminal, and where the first camera operates in a first operating state, and switching the first camera from the first operating state to a second operating state in response to an operating parameter of the terminal meeting a preset condition, where the second operating state is a low power consumption state or a closed state.

Abstract: An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

Abstract: A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.

Abstract: The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.

Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder, and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.

Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.

Abstract: An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.

Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.

Abstract: An intelligent terminal heat dissipation apparatus and an intelligent terminal are disclosed. The intelligent terminal heat dissipation apparatus includes at least one flexible heat pipe, where two ends of the flexible heat pipe are condensation ends, the middle of the flexible heat pipe is an evaporation end, the condensation end includes one or more heat pipe rigid parts and one or more heat pipe flexible parts, the one or more heat pipe rigid parts and the one or more heat pipe flexible parts of the condensation end are arranged alternately, the evaporation end includes at least one heat pipe rigid part, and an intelligent terminal body is mounted on the evaporation end. By using the intelligent terminal heat dissipation apparatus, flexible heat dissipation is implemented for a bendable device.

Abstract: A holder and a mobile terminal including the holder are disclosed. The holder is located in the mobile terminal, the holder includes a heat conduction area and a heat insulation area, the heat insulation area is close to an edge of the holder, the heat insulation area is adjacent to the heat conduction area, and a heat emitting element in the mobile terminal is proximate to the heat conduction area. The heat insulation area is provided on the holder and the heat insulation area is close to the edge of the holder and is adjacent to the heat conduction area, so that, in a process of transferring heat in the heat conduction area to the edge of the holder, the heat is impeded by the heat insulation area, thereby reducing heat at the edge of the holder.

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.