Abstract: A multi-way valve and a heat management apparatus. The transmission assembly is connected to the at least two valve cores. The driver assembly is disposed at a first end of the housing and is connected to the transmission assembly. The driver assembly is configured to drive, by using the transmission assembly, each valve core to rotate. The plurality of valve cores are sequentially disposed in the axial direction, and no radial size of the multi-way valve is additionally increased, to help implement a miniaturization design of the multi-way valve. The driver assembly may drive, by using the transmission assembly, each valve core to rotate, so that mutual interference between different valve cores can be avoided. When a connection state or a disconnection state between different interfaces needs to be switched, flexibility and reliability are good.

Abstract: A temperature control system, a vehicle, an energy storage system, and a multi-way valve. The temperature control system includes a plurality of liquid pipes and a multi-way valve. The multi-way valve includes a first valve body and a second valve body. The first valve body includes a first plane, the second valve body includes a second plane, and the first plane and the second plane are parallel and attached to each other. A driver drives the first plane and the second plane to rotate relative to each other around a rotation axis. The first plane includes a plurality of groups of first sector ring openings, the plurality of first sector ring openings are divided into a plurality of rings by using the rotation axis as a circle center and are spaced apart.

Abstract: A component carrier, including: i) a stack comprising at least two electrically conductive layer structures and at least one electrically insulating layer structure; ii) a plurality of components provided in or on the stack; iii) a plurality of electrically conductive interconnections in the stack electrically connecting at least one electrically conductive layer structure and a respective component; and iv) a test region provided in a portion of the component carrier, the test region comprising at least one test component and at least one second electrically conductive interconnection, the test component having the area where the second electrically conductive interconnection is connected with the same mechanical/chemical features and/or the same position in the depth of the correspondent one of the plurality of components, the second electrically conductive interconnection having the same mechanical/chemical features and/or the same position in the depth of at least one of the plurality of electrically cond

Abstract: A multi-port valve includes a valve body and a valve core, the valve core is located in an accommodation cavity of the valve body and is rotatably coupled to the valve body, and a rotation center line of the valve core is an axis line. A first interface and a second interface that couple with each other through the accommodation cavity are disposed on the valve body, and the first interface and the second interface are distributed on two opposite sides of the axis line. The valve core includes a first port, a second port, and a first channel that communicates the first port with the second port, the first channel penetrates the valve core, a part of the axis line is located in the first channel, the first port can communicate with the first interface, and the second port can communicate with the second interface.

Abstract: A thermal management integrated module includes a water-side component, a refrigerant component, and a heat exchanger. The water-side component and the refrigerant component are respectively located on two opposite sides of the heat exchanger. The water-side component includes a water path substrate. A plumbing of the water path substrate is configured to accommodate a first medium. The refrigerant component includes a refrigerant substrate. A plumbing of the refrigerant substrate is configured to accommodate a second medium. The heat exchanger is located in a gap space formed by the water path substrate and the refrigerant substrate. Both the plumbing of the water path substrate and the plumbing of the refrigerant substrate communicate with a plumbing of the heat exchanger. The water-side component has a first external connection port. The first external connection port is configured to connect to a water tank in the thermal management system through a coolant hose.

Abstract: A temperature control system. The temperature control system includes a plurality of liquid pipelines and a multi-port valve. The multi-port valve includes a valve body and a valve core. The valve body has a mounting cavity, and the valve core is mounted in the mounting cavity. The valve body includes a body and a block-shaped additional portion, the mounting cavity is located on the body, and the block-shaped additional portion is attached to at least a part of a side wall of the body. The valve body includes a plurality of vias, and each via penetrates the block-shaped additional portion and a corresponding side wall of the body. Each liquid pipeline is configured to communicate with one via, there is a battery pack on at least one liquid pipeline, and the temperature control system is configured to control a temperature of the battery pack.

Abstract: Provided is a preparation method of a crystalline silicon film.

Abstract: Provided is a preparation method of a crystalline silicon film. The method includes: 1) forming a mask for making a periodic silicon rod array on a monocrystalline silicon wafer substrate, and forming the periodic silicon rod array on the monocrystalline silicon substrate by a wet chemical etching or dry etching process; 2) forming barrier layers on the surface of the monocrystalline silicon substrate and the surface of the silicon rod array for next selectively epitaxial growth of silicon; 3) exposing silicon cores on the heads of the rod array by a selective etching process to form a silicon seed array; 4) growing a continuous silicon film at the top of the rod array by a chemical vapor deposition method using the exposed silicon cores as seeds for selectively epitaxial growth of silicon; and 5) lifting off the silicon film and transferring the silicon film to a preset substrate, and the seeded substrate is reusable.

Abstract: Window interface display method and system are disclosed. The window interface display method comprises: receiving a request for creating a first window, the request including type information of a window to be created and information of a data source to be loaded; determining sub-regions included in the window to be created based on the type information, wherein the sub-regions include a public region and a characteristic region, the public region includes a same portion of at least two different types of windows, and the characteristic region includes a characteristic portion of each specific type of window that is different from other types of window; loading respective control sets corresponding to the sub-regions of the first window to be created and respective data sources corresponding to the sub-regions; and displaying a result of the loading.