Abstract: An artificial chordae system can comprise a surgical pad configured to be externally positioned over an opening formed in a portion of a heart wall adjacent to a heart ventricle, and a tether comprising a cord and a tissue ingrowth promoting coating over at least a portion of the cord, the tether comprising a distal portion being configured to couple a heart valve leaflet and a proximal portion being coupled to the surgical pad. The tether can be dimensioned to extend from the heart valve leaflet through the heart ventricle to the opening in the heart wall, and through the opening in the heart wall to the surgical pad. The tissue ingrowth promoting coating can comprise a protein and be configured to promote native tissue growth over the cord to provide regenerated native tissue over the tether for coupling the heart valve leaflet to the heart wall.

Abstract: An optical transceiver includes a housing, circuit board, first heat source and heat conductive component. The housing includes first and second housing stacked on each other and together form accommodation space. The circuit board is disposed in the accommodation space. The circuit board has first and second surface. The first surface and the second surface face away from each other. The first surface faces the first housing. The second surface faces the second housing. The first heat source is disposed on the second surface of the circuit board and electrically connected to the circuit board. The heat conductive component is disposed on the first surface and thermally coupled to the first housing. Size of projection of the heat conductive component onto the second surface is larger than size of projection of the first heat source onto the second surface.

Abstract: An optical transceiver includes housing, circuit board, first heat source, second heat source, first heat conductive component and second heat conductive component. The housing includes a first housing and a second housing that are stacked on each other and together form an accommodation space. The circuit board is disposed in the accommodation space. The first heat source and the second heat source are disposed on and electrically connected to the circuit board. The first heat conductive component is disposed in the circuit board and thermally coupled to the first housing. A part of the circuit board is located between the first heat conductive component and the first heat source. The second heat conductive component is disposed on the circuit board. The second heat source is thermally coupled to the second heat conductive component. The second heat conductive component is thermally coupled to the second housing.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a heat spreader. The heat spreader includes a heat transfer portion accommodated in the housing and a heat dissipation portion exposed to outside. The heat spreader is in thermal contact with the heat source, and the heat dissipation portion of the heat spreader is in proximity of an optical port of the housing.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a heat spreader. The heat spreader includes a heat transfer portion accommodated in the housing and a heat dissipation portion exposed to outside. The heat spreader is in thermal contact with the heat source, and the heat dissipation portion of the heat spreader is in proximity of an optical port of the housing.

Abstract: A multilayer PCB structure includes a core layer, a first layer on a first surface of the core layer, a second layer on a second surface of the core layer, and a thermally conductive material in the core layer. The first surface and the second surface of the core layer are opposite to each other, and a window is formed on the second layer by removing part of the second layer. The window of the second layer exposes part of the core layer below the thermally conductive material.

Abstract: An optical transceiver includes a housing, a heat source accommodated in the housing, and a thermal interface material accommodated in the housing. The housing is in thermal contact with the heat source through the thermal interface material, and the thermal interface material is in physical contact with an uneven surface of the housing.